Top 100 US Patents in Special Component Manufacture (Printed Circuits, etc.)
section h - electricity > electric techniques not otherwise provided for > printed circuits; casings or constructional details of electric apparatus; manufacture of assemblages of electrical components
Sorted by IPQ® Score, an objective measure of patent quality. View scores and methodology at PatentRatings.com. You can also view all by publication date instead.
US5801441 (A), filed
May 15, 1995
, published
Sep 01, 1998
- TESSERA INC
A microelectronic connection component includes a dielectric sheet having an area array of elongated, strip-like leads. Each lead has a terminal end fastened to the sheet and a tip end detachable from the sheet. Each lead extends horizontally parallel to the...
US6124625 (A), filed
Aug 21, 1997
, published
Sep 26, 2000
- MICRON TECHNOLOGY INC
An extensive network of N-channel transistor formed capacitor, with one node tie directly to VCC power bus and the other node directly VSS power bus, is implemented throughout all open space available on the whole silicon chip (memory as well as logic chip),...
US6448628 (B2), filed
Jan 27, 2000
, published
Sep 10, 2002
- MICRON TECHNOLOGY INC
An extensive network of N-channel transistor formed capacitor, with one node tie directly to VCC power bus and the other node directly VSS power bus, is implemented throughout all open space available on the whole silicon chip (memory as well as logic chip),...
US4605483 (A), filed
Nov 06, 1984
, published
Aug 12, 1986
- MICHAELSON HENRY W
Apparatus for use as an electrode, which is particularly suited for use in electro-plating non-continuous conductive objects, particularly double-sided circuit boards, is described. Specifically, this electrode comprises: a housing having a plurality of sides...
US4599149 (A), filed
Dec 22, 1983
, published
Jul 08, 1986
- LEARONAL INC
This invention relates to the electrodeposition of tin, lead and particularly tin-lead alloys from an electroplating bath comprising a lead and/or tin alkylsulfonate, and alkylsulfonic acid in a sufficient amount to impart a pH below about 3 to the bath, and...
US6967183 (B2), filed
Mar 22, 2001
, published
Nov 22, 2005
- CABOT CORP
Electrocatalyst powders and methods for producing electrocatalyst powders, such as carbon composite electrocatalyst powders. The powders have a well-controlled microstructure and morphology. The method includes forming the particles from an aerosol of...
US5663901 (A), filed
Sep 12, 1995
, published
Sep 02, 1997
- SANDISK CORP
A very small computer memory card is densely packed with a large number of flash EEPROM integrated circuit chips. A computer memory system provides for the ability to removably connect one or more of such cards with a common controller circuit that interfaces...
US5605662 (A), filed
Nov 01, 1993
, published
Feb 25, 1997
- NANOGEN INC
A self-addressable, self-assembling microelectronic device is designed and fabricated to actively carry out and control multi-step and multiplex molecular biological reactions in microscopic formats. These reactions include nucleic acid hybridization,...
US6983536 (B2), filed
May 18, 2004
, published
Jan 10, 2006
- MICRON TECHNOLOGY INC
A method and apparatus for fabricating known good semiconductor dice are provided. The method includes the steps of: testing the gross functionality of dice contained on a semiconductor wafer; sawing the wafer to singulate a die; and then testing the die by...
US5909350 (A), filed
Apr 08, 1997
, published
Jun 01, 1999
- X2Y ATTENUATORS LLC
The present invention relates to a passive electronic component architecture employed in conjunction with various dielectric and combinations of dielectric materials to provide a differential and common mode filter for the suppression of electromagnetic...
US5401176 (A), filed
Mar 17, 1994
, published
Mar 28, 1995
- BERG TECH INC
A connector device comprises a housing having an internal storage space for inserting one or more storage devices therein. A shallow guide member is coupled along one of the inner side walls of the housing to define upper and lower storage spaces within the...
US6091611 (A), filed
Sep 04, 1998
, published
Jul 18, 2000
- COMARCO WIRELESS TECHNOLOGIES
The subject matter disclosed herein relates to mechanisms for programming power supply circuitry for providing an appropriate current or voltage to powering portable devices or recharge batteries. More particularly, a power supply is coupled to a portable...
US6523079 (B2), filed
Feb 15, 2001
, published
Feb 18, 2003
- ELONEX TECHNOLOGIES INC
A personal digital assistant module with a local CPU, memory, and I/O interface has a host interface comprising a bus connected to the local CPU and a connector at a surface of the personal digital assistant for interfacing to a bus connector of a host...
US7073254 (B2), filed
Dec 29, 2000
, published
Jul 11, 2006
- FORMFACTOR INC
Spring contact elements are fabricated by depositing at least one layer of metallic material into openings defined on a sacrificial substrate. The openings may be within the surface of the substrate, or in one or more layers deposited on the surface of the...
US5393489 (A), filed
Jun 16, 1993
, published
Feb 28, 1995
- IBM
Disclosed is a lead-free, high solidus temperature, high Sn alloy. The solder alloys contain in excess of 90 weight percent Sn, and an effective amount of Ag and Bi, optionally with Sb or with Sb and Cu. Another form of the alloy contains Ag and Sb, optionally...
US6294837 (B1), filed
Aug 30, 1999
, published
Sep 25, 2001
- MICRON TECHNOLOGY INC
An interconnect for semiconductor components such as dice, wafers and chip scale packages is provided. The interconnect includes a substrate, and patterns of contacts formed on a face side of the substrate adapted to electrically engage external contacts...
US4849284 (A), filed
Feb 17, 1987
, published
Jul 18, 1989
- ROGERS CORP
US6018448 (A), filed
Apr 07, 1998
, published
Jan 25, 2000
- X2Y ATTENUATORS LLC
The present invention relates to a passive electronic component architecture employed in conjunction with various dielectric and combinations of dielectric materials to provide one or more differential and common mode filters for the suppression of electromagn...
US7255954 (B2), filed
Oct 24, 2002
, published
Aug 14, 2007
- CABOT CORP
Electrocatalyst powders and energy devices fabricated using electrocatalyst powders and methods for making energy devices. The energy devices, such as fuel cells, have improved performance over a range of operating conditions.
US6741221 (B2), filed
Feb 14, 2002
, published
May 25, 2004
- INTEGRAL TECHNOLOGIES INC
Low cost antennas formed of conductive loaded resin-based materials. The conductive loaded resin-based materials are resins filled with conductive materials to provide a material which is a conductor rather than an insulator or body. The conductive materials...
US6908788 (B1), filed
Aug 13, 2003
, published
Jun 21, 2005
- BRIDGE SEMICONDUCTOR CORP
A method of connecting a conductive trace to a semiconductor chip includes providing a semiconductor chip, a conductive trace and a metal base, wherein the chip includes a conductive pad, and the conductive trace is disposed between the metal base and the...
US7115495 (B2), filed
Jun 16, 2003
, published
Oct 03, 2006
- MICRON TECHNOLOGY INC
A bumped semiconductor device contact structure is disclosed including at least one non-planar contact pad having a plurality of projections extending therefrom for contacting at least one solder ball of a bumped integrated circuit (IC) device, such as a...
US5548226 (A), filed
Jun 30, 1994
, published
Aug 20, 1996
- HITACHI LTD
A signal transmitting circuit includes one or more circuit blocks having a driving circuit and an intra-block transmission line for transmitting a signal produced by the driving circuit, one or more circuit blocks having a receiving circuit and an intra-block...
US5656862 (A), filed
May 06, 1993
, published
Aug 12, 1997
- IBM
Solder interconnection encapsulant, encapsulated structure and method for its fabrication and use, whereby the gap created by solder connections between a carrier substrate and a semiconductor device is filled with a composition obtained from curing a...
US6107109 (A), filed
Dec 18, 1997
, published
Aug 22, 2000
- MICRON TECHNOLOGY INC
An interconnect for semiconductor components such as dice, wafers and chip scale packages is provided. The interconnect includes a substrate, and patterns of contacts formed on a face side of the substrate adapted to electrically engage external contacts...
US5541525 (A), filed
Nov 14, 1994
, published
Jul 30, 1996
- MICRON TECHNOLOGY INC
A carrier for testing an unpackaged semiconductor die is provided. The carrier includes: a base; a temporary interconnect for establishing electrical communication between the die and external test circuitry; a retention mechanism for securing the interconnect...
US4993097 (A), filed
Jan 22, 1990
, published
Feb 19, 1991
- DEM CONTROLS CANADA
An apparatus and method are disclosed for deburring the surface of a printed circuit board passing along a moving conveyor. The apparatus comprises a rotating brush head for abrading against the first surface of the printed circuit board. A three phase...
US7172785 (B2), filed
Jul 07, 2003
, published
Feb 06, 2007
- THOMPSON G ALAN
The invention relates to a process for depositing a metal on a material. The process comprises the steps of: immersing the material in deposition solution comprising the metal; inducing a material vibration in the deposition solution having a frequency...
US5905382 (A), filed
May 06, 1996
, published
May 18, 1999
- MICRON TECHNOLOGY INC
A reusable burn-in/test fixture for testing unsingulated dice on a semiconductor wafer consisting of two halves. The first half of the test fixture is a die cavity plate for receiving the wafer, and the second half establishes electrical communication between...
US6913468 (B2), filed
Oct 10, 2003
, published
Jul 05, 2005
- FORMFACTOR INC
Surface-mount, solder-down sockets are described which permit electronic components such as semiconductor packages to be releasably mounted to a circuit board. Generally, the socket includes resilient contact structures extending from a top surface of a...
US5240169 (A), filed
Oct 15, 1992
, published
Aug 31, 1993
- ELECTROVERT LTD
A cover plate or shroud extends over a solder reservoir and has a slot for a solder wave to extend up above the cover plate. A reduced oxygen atmosphere is supplied from gas outlets under the cover plate on both sides of the solder wave. Furthermore a gas...
US4717438 (A), filed
Sep 29, 1986
, published
Jan 05, 1988
- MONARCH MARKING SYSTEMS INC
This invention relates to a tag useable with an electronic article surveillance system and comprised of planar conductive material cut into a pair of inverse, first and second spiral conductors wrapped about each other and positioned for capacitive and...
US6091254 (A), filed
Dec 14, 1998
, published
Jul 18, 2000
- MICRON TECHNOLOGY INC
A reusable burn-in/test fixture for testing unsingulated dice on a semiconductor wafer consists of two halves. The first half of the test fixture is a wafer cavity plate for receiving the wafer, and the second half establishes electrical communication between...
US4419675 (A), filed
May 24, 1979
, published
Dec 06, 1983
- HOECHST CO AMERICAN
Imaging system and method suitable for producing artwork masters for use in the manufacture of printed circuit boards. A beam of coherent radiation is modulated in accordance with data from a source defining the image to be produced, and the modulated beam is...
US6104087 (A), filed
Aug 24, 1998
, published
Aug 15, 2000
- TESSERA INC
A microelectronic connection component includes a dielectric sheet having an area array of elongated, strip-like leads. Each lead has a terminal end fastened to the sheet and a tip end detachable from the sheet. Each lead extends horizontally parallel to the...
US4959751 (A), filed
Jan 17, 1989
, published
Sep 25, 1990
- DELCO ELECTRONICS CORP
A printed circuit board assembly uses a conductive pattern that includes both firmly adherent conductors and controllably adherent conductors. The controllably adhering conductors are free to lift off the printed circuit board to relieve mechanical forces...
US5491597 (A), filed
Apr 15, 1994
, published
Feb 13, 1996
- HUTCHINSON TECHNOLOGY
A gimbal flexure and electrical interconnect assembly for attachment to a disk drive suspension assembly. The gimbal flexure and electrical interconnect acts both as an interconnect system for relaying electrical signals and as a gimbal flexure. It comprises a...
US4327124 (A), filed
Dec 13, 1979
, published
Apr 27, 1982
- DESMARAIS JR RAYMOND C
Printed circuits are produced by an additive technique wherein a metal-loaded resinous ink is first printed on the board, the circuit next being covered with a conductive metal powder while the ink is still wet. The powder is then pressed into the ink and the...
US5068712 (A), filed
Sep 19, 1989
, published
Nov 26, 1991
- HITACHI LTD
As the semiconductor chip is large-sized, highly integrated and speeded up, it becomes difficult to pack the semiconductor chip together with leads in a package. In view of this difficulty, there has been adopted the package structure called the "Lead-On-Chip"...
US5218034 (A), filed
Aug 21, 1991
, published
Jun 08, 1993
- DU PONT
USRE36396 (E), filed
Jan 27, 1995
, published
Nov 16, 1999
- ROGERS CORP
A ceramic filled fluoropolymer-based electrical substrate material well suited for forming rigid printed wiring board substrate materials and integrated circuit chip carriers is presented which exhibits improved electrical performance over other printed wiring...
US6304450 (B1), filed
Jul 15, 1999
, published
Oct 16, 2001
- INCEP TECHNOLOGIES INC
An encapsulated circuit assembly and a method for making an encapsulated circuit assembly are disclosed. The assembly comprises a first printed circuit board, a second printed circuit board, and a heat transfer device. The second printed circuit board...
US7077882 (B2), filed
Jul 16, 2004
, published
Jul 18, 2006
- CABOT CORP
Gold powders and methods for producing gold powders. The powders preferably have a small particle size, narrow size distribution and a spherical morphology. The method includes forming the particles by a spray pyrolysis technique. The invention also includes...
US5914481 (A), filed
Oct 07, 1997
, published
Jun 22, 1999
- NORAND CORP
A pocket-sized hand-held data processing device with a coupling system, a user interface and an optical indicia reader. The device can include a display to display alphanumeric information. The display can have a touch screen input area and a handwritten input...
US4754009 (A), filed
Sep 04, 1986
, published
Jun 28, 1988
- DU PONT
Amorphous copolymer of perfluoro-2,2-dimethyl-1,3-dioxide with at least one fluoro comonomer selected from one or more of ten defined classes having a recited minimum mole proportion of perfluoro-2,2-dimethyl-1,3-dioxole, in no event less than 65%, have high...
US6184568 (B1), filed
Nov 07, 1997
, published
Feb 06, 2001
- MICRON TECHNOLOGY INC
A SIMM (single in-line memory module) board is provided with a plurality of integrated semiconductor memory or other integrated semiconductor circuit devices which include, as a part of each integrated circuit device, a current spike leveling capacitor. The...
US5530286 (A), filed
Aug 22, 1994
, published
Jun 25, 1996
- HITACHI LTD
As the semiconductor chip is large-sized, highly integrated and speeded up, it becomes difficult to pack the semiconductor chip together with leads in a package. In view of this difficulty, there has been adopted the package structure called the "Lead-On-Chip"...
US6134075 (A), filed
Jul 02, 1996
, published
Oct 17, 2000
- HUTCHINSON TECHNOLOGY
A trace interconnect assembly is designed for transmitting electrical signals to and from a head assembly in a hard disk drive. The interconnect assembly includes one or more single-layer thin, elongated, and generally flat substrate-free trace interconnects....
US6384473 (B1), filed
May 16, 2000
, published
May 07, 2002
- SANDIA CORP
An apparatus for packaging of microelectronic devices, including an integral window. The microelectronic device can be a semiconductor chip, a CCD chip, a CMOS chip, a VCSEL chip, a laser diode, a MEMS device, or a IMEMS device. The package can include a...
US5471091 (A), filed
Aug 26, 1991
, published
Nov 28, 1995
- LSI LOGIC CORP
Via filling is enhanced by the techniques of 1) providing pillars immediately underneath semiconductor features, such as metal layer contacts (inter-connection points), and 2) polishing off excess via-filling material so that the via-filling plug is flush with...
US6261856 (B1), filed
Dec 10, 1998
, published
Jul 17, 2001
- SEMICONDUCTOR ENERGY LAB
A method for treating an object with a laser including emitting a laser beam from a laser; expanding the laser beam in a first direction; removing a portion of the laser beam though a mask, the portion including at least edges of the expanded laser beam...
US6339191 (B1), filed
Mar 11, 1994
, published
Jan 15, 2002
- SILICON BANDWIDTH INC
A semiconductor die carrier includes a plurality of electrically insulative side walls; a plurality of electrically conductive leads extending from at least one of the side walls, each of the leads being individually manufactured without use of a lead frame; a...
US6414506 (B2), filed
Dec 17, 1998
, published
Jul 02, 2002
- MICRON TECHNOLOGY INC
A method for testing unpackaged semiconductor dice having raised contact locations (e.g., bumped bond pads) and a method for forming an interconnect suitable for testing this type of dice are provided. The interconnect includes a substrate having contact...
US6707140 (B1), filed
May 09, 2000
, published
Mar 16, 2004
- NAT SEMICONDUCTOR CORP
A stacked molded package comprising a semiconductor package attached to an electronic device. The semiconductor package includes a semiconductor die which is connected to a set of wire leads and is encapsulated within a protective molding material. Additionall...
US5523697 (A), filed
Mar 04, 1994
, published
Jun 04, 1996
- MICRON TECHNOLOGY INC
A method of engaging electrically conductive test pads on a semiconductor substrate having integrated circuitry for operability testing thereof includes: a) providing an engagement probe having an outer surface comprising a grouping of a plurality of...
US6660680 (B1), filed
Mar 22, 2000
, published
Dec 09, 2003
- SUPERIOR MICROPOWDERS LLC
Electrocatalyst powders and methods for producing electrocatalyst powders, such as carbon composite electrocatalyst powders. The powders have a well-controlled microstructure and morphology. The method includes forming the particles from an aerosol of...
US5910685 (A), filed
Dec 03, 1997
, published
Jun 08, 1999
- AKITA ELECTRONICS CO LTD
In the present invention, memory chips are stuck together in stacked fashion by TAB (tape automated bonding), and a multiple memory chip and lead complex like an SOP (small out-line package) is formed of the chips and leads, whereby a memory module of high...
US4605278 (A), filed
May 24, 1985
, published
Aug 12, 1986
- NORTH AMERICAN SPECIALITIES
A solder-bearing lead useful as a terminal or contact which may be fabricated by rapid progressive stamping techniques is disclosed in which side ears are formed on the contact blank, and then bent upwardly out of their initial plane. These ears are formed to...
US5931685 (A), filed
Jun 02, 1997
, published
Aug 03, 1999
- MICRON TECHNOLOGY INC
An interconnect and system for establishing temporary electrical communication with semiconductor components having contact bumps are provided. The interconnect includes a substrate with patterns of contact members adapted to electrically contact the contact...
US4877326 (A), filed
Feb 19, 1988
, published
Oct 31, 1989
- KLA INSTR CORP
Substrate inspection apparatus and methods, and illumination apparatus. The inspection apparatus and method includes memory for storing the desired features of the surface of the substrate, focussed illuminator for substantially uniformly illuminating a region...
US6766093 (B2), filed
Mar 22, 2001
, published
Jul 20, 2004
- PANDUIT CORP
A cable manager provides horizontal cable management of adjacent patch panels or network equipment on network distribution racks. The cable manager includes a central section and a front cable routing section and is mountable on a network rack, such as an EIA...
US5239198 (A), filed
Jul 02, 1992
, published
Aug 24, 1993
- MOTOROLA INC
A low cost manufacturing method is used to fabricate a small multiple chip semiconductor device (10). In one embodiment, a first pattern of conductive traces (14) is formed on one surface of a substrate (12), and a second pattern of traces (16) is formed on a...
US6210537 (B1), filed
Jun 19, 1995
, published
Apr 03, 2001
- LYNNTECH INC
The present invention provides electronically conducting polymer films formed from photosensitive formulations of pyrrole and an electron acceptor that have been selectively exposed to UV light, laser light, or electron beams. The formulations may include...
US6753922 (B1), filed
Oct 13, 1998
, published
Jun 22, 2004
- INTEL CORP
An imaging system includes an image sensor that is attached to a circuit board via a mass reflow process. The image sensor captures image data and provides the image data at an output of the imaging system. In one embodiment, the image sensor uses a color...
US5463227 (A), filed
Jun 24, 1992
, published
Oct 31, 1995
- ROBOTIC VISION SYSTEMS
Methods and arrangements are provided to efficiently use 3-D vision systems to measure selected features of objects that are semi-constrained in compartmented trays having a uniform geometric arrangement. The methods are particularly well suited for optimizing...
US5984464 (A), filed
Jul 11, 1997
, published
Nov 16, 1999
- HEWLETT PACKARD CO
An inkjet printhead includes a compact substrate of increased stability and structural integrity to provide a high resolution 600 dot-per-inch nozzle array having a one-half inch swath. A plurality of ink vaporization chambers are respectively aligned with the...
US5879965 (A), filed
Jun 19, 1997
, published
Mar 09, 1999
- MICRON TECHNOLOGY INC
A conductive plastic lead frame and method of manufacturing same, suitable for use in IC packaging. In a preferred embodiment the lead frame is constructed of a plastic or polymer based lead frame structure with an intrinsic conductive polymer coating. In a...
US6838893 (B2), filed
Jun 10, 2003
, published
Jan 04, 2005
- FORMFACTOR INC
In a probe card assembly, a series of probe elements can be arrayed on a silicon space transformer. The silicon space transformer can be fabricated with an array of primary contacts in a very tight pitch, comparable to the pitch of a semiconductor device. One...
US5518964 (A), filed
Jul 07, 1994
, published
May 21, 1996
- TESSERA INC
A microelectronic connection component includes a dielectric sheet having an area array of elongated, strip-like leads. Each lead has a terminal end fastened to the sheet and a tip end detachable from the sheet. Each lead extends horizontally parallel to the...
US5137991 (A), filed
Oct 19, 1989
, published
Aug 11, 1992
- UNIV OHIO STATE RES FOUND
Self-prontonated sulfonic acid-substituted polyaniline compositions, processes for their preparation and uses therefor are disclosed. The sulfonated polyaniline compositions have faster electronic and optical responses to electrochemical potentials comparing...
US4728305 (A), filed
Apr 11, 1986
, published
Mar 01, 1988
- NORTH AMERICAN SPECIALITIES
A solder-bearing terminal is formed from a blank having a main body portion and side tabs extending laterally from it, which are bent perpendicularly to the main body. The tabs may be formed in pairs to retain a solder mass therebetween, or may be in the form...
US4657136 (A), filed
Mar 26, 1985
, published
Apr 14, 1987
- RICOH KK
A receptacle for detachably receiving a memory cassette is disclosed. A holder member reciprocates in unison with the movement of an openable cover member to hold the memory cassette thereon. Drive means is provided for driving the holder member in a...
US5673179 (A), filed
Jul 29, 1996
, published
Sep 30, 1997
- US3 INC
A reinforcement structure to protect an integrated circuit module located within a smart card. The integrated circuit module is positioned in a cavity formed in a first surface of the smart card. The reinforcement structure, which has a modulus of elasticity...
US6342789 (B1), filed
Dec 14, 1998
, published
Jan 29, 2002
- MICRON TECHNOLOGY INC
A reusable burn-in/test fixture for testing unsingulated dice on a semiconductor wafer consists of two halves. The first half of the test fixture is a wafer cavity plate for receiving the wafer, and the second half establishes electrical communication between...
US5674596 (A), filed
Oct 01, 1992
, published
Oct 07, 1997
- JOHNSON JOHNSTON ASS INC
A component for use in manufacturing articles such as printed circuit bards comprising a laminate of a sheet of copper foil and a sheet of aluminum or the like. A band of flexible adhesive joins the sheets around their borders and creates a protected central...
US4502193 (A), filed
Dec 14, 1981
, published
Mar 05, 1985
- HARTWELL CORP
A fastener for locking two objects in a predetermined relationship. The fastener has a fastener body including a spacer which defines a predetermined distance between the two objects. A first locking element is on one side of the spacer and a second locking...
US7125586 (B2), filed
Mar 30, 2004
, published
Oct 24, 2006
- DELPHI TECH INC
Disclosed is a process for applying a kinetic spray coating of powder particles onto a substrate covered in a plastic-type material without first removing the plastic-type material. In one use of the process a mask is used to enable a single kinetic spray pass...
US5290396 (A), filed
Jun 06, 1991
, published
Mar 01, 1994
- LSI LOGIC CORP
Various techniques for quantifying polishing performance are disclosed, and provide insight on the progression from a planarization regime to a smoothing regime to a blanket polish back regime, as well as providing a single, definable parameter (Quality...
US6522018 (B1), filed
May 16, 2000
, published
Feb 18, 2003
- MICRON TECHNOLOGY INC
A stackable ball grid array (BGA) or fine ball grid array (FBGA) semiconductor package particularly suitable for board-on-chip or chip-on-board applications in which a low profile BGA or FBGA semiconductor package is needed. The present invention provides a...
US5326428 (A), filed
Sep 03, 1993
, published
Jul 05, 1994
- MICRON SEMICONDUCTOR INC
A method of engaging electrically conductive test pads on a semiconductor substrate having integrated circuitry for operability testing thereof includes: a) providing an engagement probe having an outer surface comprising a grouping of a plurality of...
US4778552 (A), filed
Apr 22, 1987
, published
Oct 18, 1988
- MONARCH MARKING SYSTEMS INC
This invention relates to a deactivatable tag useable with an electronic article surveillance system and comprised of planar conductive material cut into a pair of inverse, first and second spiral conductors wrapped about each other and positioned for...
US6133639 (A), filed
Apr 24, 1997
, published
Oct 17, 2000
- TESSERA INC
A method and an apparatus for providing a planar and compliant interface between a semiconductor chip and its supporting substrate to accommodate for the thermal coefficient of expansion mismatch therebetween. The complaint interface is comprised of a...
US6537720 (B1), filed
Oct 30, 1996
, published
Mar 25, 2003
- POLAROID GRAPHICS IMAGING LLC
A unique method/system for simultaneously creating and transferring a contrasting pattern of intelligence on and from an ablation-transfer imaging medium to a receptor element in contiguous registration therewith is not dependent upon contrast imaging...
US4395184 (A), filed
Feb 21, 1980
, published
Jul 26, 1983
- PALOMAR SYSTEMS MACHINES INC
Miniature electronic component parts such as capacitors or resistors are end conductively coated by use of a part handling plate having a multiplicity of passageways therethrough with walls coated by resilient material to grip the parts. A bank of pins in a...
US6946324 (B1), filed
Oct 30, 2003
, published
Sep 20, 2005
- ASAT LTD
A process for fabricating a leadless plastic chip carrier includes laminating a first metal strip to a second metal strip to form a leadframe strip, selectively etching the first metal strip to define at least a row of contact pads, mounting a semiconductor...
US4606968 (A), filed
Jul 25, 1983
, published
Aug 19, 1986
- STERN AND STERN TEXTILES INC
An electrostatic dissipating fabric constructed of a woven or knitted base fabric having an integrally woven or knitted grid structure which is raised above the surface of the base fabric thereby resulting in increased electrostatic dissipation performance....
US6114088 (A), filed
Jan 15, 1999
, published
Sep 05, 2000
- 3M INNOVATIVE PROPERTIES CO
A thermal transfer element for forming a multilayer device may include a substrate and a multicomponent transfer unit that, when transferred to a receptor, is configured and arranged to form a first operational layer and a second operational layer of a...
US5397857 (A), filed
Jul 15, 1993
, published
Mar 14, 1995
- DUAL SYSTEMS
A container for a memory card and the process by which the container is manufactured. The container comprises chiefly two stamped steel covers, (an upper and a lower cover half), each secured to a plastic frame element. The cover halves are secured by extended...
US5479331 (A), filed
Apr 26, 1994
, published
Dec 26, 1995
- COMARCO WIRELESS TECHNOLOGIES
A new, small form factor power supply is disclosed that provides a regulated DC power supply in a package that radiates relatively little heat and that occupies 2.75'' by 4.5'' by 0.75''. The secondary coil of the transformer is positioned at the summing node...
US6569753 (B1), filed
Jun 08, 2000
, published
May 27, 2003
- MICRON TECHNOLOGY INC
Dielectric collars to be disposed around contact pads on a surface of a semiconductor device or another substrate and methods of fabricating and disposing the collars on semiconductor devices and other substrates. Semiconductor devices including the collars...
US7142000 (B2), filed
Sep 29, 2003
, published
Nov 28, 2006
- FORMFACTOR INC
Resilient contact structures are mounted directly to bond pads on semiconductor dies, prior to the dies being singulated (separated) from a semiconductor wafer. This enables the semiconductor dies to be exercised (e.g., tested and/or burned-in) by connecting...
US4306925 (A), filed
Sep 16, 1980
, published
Dec 22, 1981
- PACTEL CORP
A printed circuit which may be highly flexible in configuration and design includes at least one uniformly thick, planar circuit layer including a conductive circuit pattern and an insulating circuit pattern of a cured, flowable insulating material. The...
US4603320 (A), filed
Apr 13, 1983
, published
Jul 29, 1986
- RAPITECH SYSTEMS INC
A connector interface for enabling communications between first and second data handling systems wherein the data in the first system is arranged in a first type of format and the data in the second system is arranged in a second type of format, includes a...
US6740962 (B1), filed
Feb 24, 2000
, published
May 25, 2004
- MICRON TECHNOLOGY INC
Stiffeners for tapes, films, or other connective structures that are configured to be secured to a semiconductor device component, such as a semiconductor die or substrate, by tape-automated bonding processes. The stiffeners are fabricated by stereolithographi...
US4666545 (A), filed
Jun 27, 1984
, published
May 19, 1987
- BERGQUIST CO
A mounting pad means for use in combination with solid-state semiconductive translating devices and including a base pad with flange walls extending from said base pad, and with device mounting pad means being secured to the surface of the base pad and...
US6359236 (B1), filed
Aug 13, 1996
, published
Mar 19, 2002
- TESSERA INC
A semiconductor chip mounting component includes a support structure having top and bottom surfaces and an edge, a plurality of electrically conductive leads, not attached to a chip, each lead having a first end securement section secured to the support...
US6051878 (A), filed
Jan 19, 1999
, published
Apr 18, 2000
- MICRON TECHNOLOGY INC
A semiconductor package comprising multiple stacked substrates having flip chips attached to the substrates with chip on board assembly techniques to achieve dense packaging. The substrates are preferably stacked atop one another by electric connections which...
US5821624 (A), filed
Jun 05, 1995
, published
Oct 13, 1998
- LSI LOGIC CORP
An interposer (preformed planar structure) is disposed between a die and a substrate (which may be another die). Through holes in the interposer facilitate controlled formation of electrical connections between the die and the substrate. In one embodiment, the...
US6356448 (B1), filed
Nov 02, 1999
, published
Mar 12, 2002
- INCEPTECHNOLOGIES INC
An encapsulated circuit assembly and methods for making an encapsulated circuit assembly for power delivery are disclosed. The assembly comprises a first printed circuit board, a second printed circuit board, and a mechanical coupler. The mechanical coupler is...
US6376049 (B1), filed
Jul 23, 1999
, published
Apr 23, 2002
- IBIDEN CO LTD
A multilayer printed wiring board is composed of a substrate provided with through-holes, and a wiring board formed on the substrate through the interposition of an interlaminar insulating resin layer, the through-holes having a roughened internal surface and...
