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Top 100 US Patents in Special Component Manufacture (Printed Circuits, etc.)

section h - electricity > electric techniques not otherwise provided for > printed circuits; casings or constructional details of electric apparatus; manufacture of assemblages of electrical components

Sorted by IPQ® Score, an objective measure of patent quality. View scores and methodology at PatentRatings.com. You can also view all by publication date instead.
US5801441 (A), filed May 15, 1995 , published Sep 01, 1998 - TESSERA INC
A microelectronic connection component includes a dielectric sheet having an area array of elongated, strip-like leads. Each lead has a terminal end fastened to the sheet and a tip end detachable from the sheet. Each lead extends horizontally parallel to the...
US6124625 (A), filed Aug 21, 1997 , published Sep 26, 2000 - MICRON TECHNOLOGY INC
An extensive network of N-channel transistor formed capacitor, with one node tie directly to VCC power bus and the other node directly VSS power bus, is implemented throughout all open space available on the whole silicon chip (memory as well as logic chip),...
US6448628 (B2), filed Jan 27, 2000 , published Sep 10, 2002 - MICRON TECHNOLOGY INC
An extensive network of N-channel transistor formed capacitor, with one node tie directly to VCC power bus and the other node directly VSS power bus, is implemented throughout all open space available on the whole silicon chip (memory as well as logic chip),...
US4605483 (A), filed Nov 06, 1984 , published Aug 12, 1986 - MICHAELSON HENRY W
Apparatus for use as an electrode, which is particularly suited for use in electro-plating non-continuous conductive objects, particularly double-sided circuit boards, is described. Specifically, this electrode comprises: a housing having a plurality of sides...
US4599149 (A), filed Dec 22, 1983 , published Jul 08, 1986 - LEARONAL INC
This invention relates to the electrodeposition of tin, lead and particularly tin-lead alloys from an electroplating bath comprising a lead and/or tin alkylsulfonate, and alkylsulfonic acid in a sufficient amount to impart a pH below about 3 to the bath, and...
US6967183 (B2), filed Mar 22, 2001 , published Nov 22, 2005 - CABOT CORP
Electrocatalyst powders and methods for producing electrocatalyst powders, such as carbon composite electrocatalyst powders. The powders have a well-controlled microstructure and morphology. The method includes forming the particles from an aerosol of...
US5663901 (A), filed Sep 12, 1995 , published Sep 02, 1997 - SANDISK CORP
A very small computer memory card is densely packed with a large number of flash EEPROM integrated circuit chips. A computer memory system provides for the ability to removably connect one or more of such cards with a common controller circuit that interfaces...
US5605662 (A), filed Nov 01, 1993 , published Feb 25, 1997 - NANOGEN INC
A self-addressable, self-assembling microelectronic device is designed and fabricated to actively carry out and control multi-step and multiplex molecular biological reactions in microscopic formats. These reactions include nucleic acid hybridization,...
US6983536 (B2), filed May 18, 2004 , published Jan 10, 2006 - MICRON TECHNOLOGY INC
A method and apparatus for fabricating known good semiconductor dice are provided. The method includes the steps of: testing the gross functionality of dice contained on a semiconductor wafer; sawing the wafer to singulate a die; and then testing the die by...
US5909350 (A), filed Apr 08, 1997 , published Jun 01, 1999 - X2Y ATTENUATORS LLC
The present invention relates to a passive electronic component architecture employed in conjunction with various dielectric and combinations of dielectric materials to provide a differential and common mode filter for the suppression of electromagnetic...
US5401176 (A), filed Mar 17, 1994 , published Mar 28, 1995 - BERG TECH INC
A connector device comprises a housing having an internal storage space for inserting one or more storage devices therein. A shallow guide member is coupled along one of the inner side walls of the housing to define upper and lower storage spaces within the...
US6091611 (A), filed Sep 04, 1998 , published Jul 18, 2000 - COMARCO WIRELESS TECHNOLOGIES
The subject matter disclosed herein relates to mechanisms for programming power supply circuitry for providing an appropriate current or voltage to powering portable devices or recharge batteries. More particularly, a power supply is coupled to a portable...
US6523079 (B2), filed Feb 15, 2001 , published Feb 18, 2003 - ELONEX TECHNOLOGIES INC
A personal digital assistant module with a local CPU, memory, and I/O interface has a host interface comprising a bus connected to the local CPU and a connector at a surface of the personal digital assistant for interfacing to a bus connector of a host...
US7073254 (B2), filed Dec 29, 2000 , published Jul 11, 2006 - FORMFACTOR INC
Spring contact elements are fabricated by depositing at least one layer of metallic material into openings defined on a sacrificial substrate. The openings may be within the surface of the substrate, or in one or more layers deposited on the surface of the...
US5393489 (A), filed Jun 16, 1993 , published Feb 28, 1995 - IBM
Disclosed is a lead-free, high solidus temperature, high Sn alloy. The solder alloys contain in excess of 90 weight percent Sn, and an effective amount of Ag and Bi, optionally with Sb or with Sb and Cu. Another form of the alloy contains Ag and Sb, optionally...
US6294837 (B1), filed Aug 30, 1999 , published Sep 25, 2001 - MICRON TECHNOLOGY INC
An interconnect for semiconductor components such as dice, wafers and chip scale packages is provided. The interconnect includes a substrate, and patterns of contacts formed on a face side of the substrate adapted to electrically engage external contacts...
US4849284 (A), filed Feb 17, 1987 , published Jul 18, 1989 - ROGERS CORP
US6018448 (A), filed Apr 07, 1998 , published Jan 25, 2000 - X2Y ATTENUATORS LLC
The present invention relates to a passive electronic component architecture employed in conjunction with various dielectric and combinations of dielectric materials to provide one or more differential and common mode filters for the suppression of electromagn...
US7255954 (B2), filed Oct 24, 2002 , published Aug 14, 2007 - CABOT CORP
Electrocatalyst powders and energy devices fabricated using electrocatalyst powders and methods for making energy devices. The energy devices, such as fuel cells, have improved performance over a range of operating conditions.
US6741221 (B2), filed Feb 14, 2002 , published May 25, 2004 - INTEGRAL TECHNOLOGIES INC
Low cost antennas formed of conductive loaded resin-based materials. The conductive loaded resin-based materials are resins filled with conductive materials to provide a material which is a conductor rather than an insulator or body. The conductive materials...
US6908788 (B1), filed Aug 13, 2003 , published Jun 21, 2005 - BRIDGE SEMICONDUCTOR CORP
A method of connecting a conductive trace to a semiconductor chip includes providing a semiconductor chip, a conductive trace and a metal base, wherein the chip includes a conductive pad, and the conductive trace is disposed between the metal base and the...
US7115495 (B2), filed Jun 16, 2003 , published Oct 03, 2006 - MICRON TECHNOLOGY INC
A bumped semiconductor device contact structure is disclosed including at least one non-planar contact pad having a plurality of projections extending therefrom for contacting at least one solder ball of a bumped integrated circuit (IC) device, such as a...
US5548226 (A), filed Jun 30, 1994 , published Aug 20, 1996 - HITACHI LTD
A signal transmitting circuit includes one or more circuit blocks having a driving circuit and an intra-block transmission line for transmitting a signal produced by the driving circuit, one or more circuit blocks having a receiving circuit and an intra-block...
US5656862 (A), filed May 06, 1993 , published Aug 12, 1997 - IBM
Solder interconnection encapsulant, encapsulated structure and method for its fabrication and use, whereby the gap created by solder connections between a carrier substrate and a semiconductor device is filled with a composition obtained from curing a...
US6107109 (A), filed Dec 18, 1997 , published Aug 22, 2000 - MICRON TECHNOLOGY INC
An interconnect for semiconductor components such as dice, wafers and chip scale packages is provided. The interconnect includes a substrate, and patterns of contacts formed on a face side of the substrate adapted to electrically engage external contacts...
US5541525 (A), filed Nov 14, 1994 , published Jul 30, 1996 - MICRON TECHNOLOGY INC
A carrier for testing an unpackaged semiconductor die is provided. The carrier includes: a base; a temporary interconnect for establishing electrical communication between the die and external test circuitry; a retention mechanism for securing the interconnect...
US4993097 (A), filed Jan 22, 1990 , published Feb 19, 1991 - DEM CONTROLS CANADA
An apparatus and method are disclosed for deburring the surface of a printed circuit board passing along a moving conveyor. The apparatus comprises a rotating brush head for abrading against the first surface of the printed circuit board. A three phase...
US7172785 (B2), filed Jul 07, 2003 , published Feb 06, 2007 - THOMPSON G ALAN
The invention relates to a process for depositing a metal on a material. The process comprises the steps of: immersing the material in deposition solution comprising the metal; inducing a material vibration in the deposition solution having a frequency...
US5905382 (A), filed May 06, 1996 , published May 18, 1999 - MICRON TECHNOLOGY INC
A reusable burn-in/test fixture for testing unsingulated dice on a semiconductor wafer consisting of two halves. The first half of the test fixture is a die cavity plate for receiving the wafer, and the second half establishes electrical communication between...
US6913468 (B2), filed Oct 10, 2003 , published Jul 05, 2005 - FORMFACTOR INC
Surface-mount, solder-down sockets are described which permit electronic components such as semiconductor packages to be releasably mounted to a circuit board. Generally, the socket includes resilient contact structures extending from a top surface of a...
US5240169 (A), filed Oct 15, 1992 , published Aug 31, 1993 - ELECTROVERT LTD
A cover plate or shroud extends over a solder reservoir and has a slot for a solder wave to extend up above the cover plate. A reduced oxygen atmosphere is supplied from gas outlets under the cover plate on both sides of the solder wave. Furthermore a gas...
US4717438 (A), filed Sep 29, 1986 , published Jan 05, 1988 - MONARCH MARKING SYSTEMS INC
This invention relates to a tag useable with an electronic article surveillance system and comprised of planar conductive material cut into a pair of inverse, first and second spiral conductors wrapped about each other and positioned for capacitive and...
US6091254 (A), filed Dec 14, 1998 , published Jul 18, 2000 - MICRON TECHNOLOGY INC
A reusable burn-in/test fixture for testing unsingulated dice on a semiconductor wafer consists of two halves. The first half of the test fixture is a wafer cavity plate for receiving the wafer, and the second half establishes electrical communication between...
US4419675 (A), filed May 24, 1979 , published Dec 06, 1983 - HOECHST CO AMERICAN
Imaging system and method suitable for producing artwork masters for use in the manufacture of printed circuit boards. A beam of coherent radiation is modulated in accordance with data from a source defining the image to be produced, and the modulated beam is...
US6104087 (A), filed Aug 24, 1998 , published Aug 15, 2000 - TESSERA INC
A microelectronic connection component includes a dielectric sheet having an area array of elongated, strip-like leads. Each lead has a terminal end fastened to the sheet and a tip end detachable from the sheet. Each lead extends horizontally parallel to the...
US4959751 (A), filed Jan 17, 1989 , published Sep 25, 1990 - DELCO ELECTRONICS CORP
A printed circuit board assembly uses a conductive pattern that includes both firmly adherent conductors and controllably adherent conductors. The controllably adhering conductors are free to lift off the printed circuit board to relieve mechanical forces...
US5491597 (A), filed Apr 15, 1994 , published Feb 13, 1996 - HUTCHINSON TECHNOLOGY
A gimbal flexure and electrical interconnect assembly for attachment to a disk drive suspension assembly. The gimbal flexure and electrical interconnect acts both as an interconnect system for relaying electrical signals and as a gimbal flexure. It comprises a...
US4327124 (A), filed Dec 13, 1979 , published Apr 27, 1982 - DESMARAIS JR RAYMOND C
Printed circuits are produced by an additive technique wherein a metal-loaded resinous ink is first printed on the board, the circuit next being covered with a conductive metal powder while the ink is still wet. The powder is then pressed into the ink and the...
US5068712 (A), filed Sep 19, 1989 , published Nov 26, 1991 - HITACHI LTD
As the semiconductor chip is large-sized, highly integrated and speeded up, it becomes difficult to pack the semiconductor chip together with leads in a package. In view of this difficulty, there has been adopted the package structure called the "Lead-On-Chip"...
US5218034 (A), filed Aug 21, 1991 , published Jun 08, 1993 - DU PONT
USRE36396 (E), filed Jan 27, 1995 , published Nov 16, 1999 - ROGERS CORP
A ceramic filled fluoropolymer-based electrical substrate material well suited for forming rigid printed wiring board substrate materials and integrated circuit chip carriers is presented which exhibits improved electrical performance over other printed wiring...
US6304450 (B1), filed Jul 15, 1999 , published Oct 16, 2001 - INCEP TECHNOLOGIES INC
An encapsulated circuit assembly and a method for making an encapsulated circuit assembly are disclosed. The assembly comprises a first printed circuit board, a second printed circuit board, and a heat transfer device. The second printed circuit board...
US7077882 (B2), filed Jul 16, 2004 , published Jul 18, 2006 - CABOT CORP
Gold powders and methods for producing gold powders. The powders preferably have a small particle size, narrow size distribution and a spherical morphology. The method includes forming the particles by a spray pyrolysis technique. The invention also includes...
US5914481 (A), filed Oct 07, 1997 , published Jun 22, 1999 - NORAND CORP
A pocket-sized hand-held data processing device with a coupling system, a user interface and an optical indicia reader. The device can include a display to display alphanumeric information. The display can have a touch screen input area and a handwritten input...
US4754009 (A), filed Sep 04, 1986 , published Jun 28, 1988 - DU PONT
Amorphous copolymer of perfluoro-2,2-dimethyl-1,3-dioxide with at least one fluoro comonomer selected from one or more of ten defined classes having a recited minimum mole proportion of perfluoro-2,2-dimethyl-1,3-dioxole, in no event less than 65%, have high...
US6184568 (B1), filed Nov 07, 1997 , published Feb 06, 2001 - MICRON TECHNOLOGY INC
A SIMM (single in-line memory module) board is provided with a plurality of integrated semiconductor memory or other integrated semiconductor circuit devices which include, as a part of each integrated circuit device, a current spike leveling capacitor. The...
US5530286 (A), filed Aug 22, 1994 , published Jun 25, 1996 - HITACHI LTD
As the semiconductor chip is large-sized, highly integrated and speeded up, it becomes difficult to pack the semiconductor chip together with leads in a package. In view of this difficulty, there has been adopted the package structure called the "Lead-On-Chip"...
US6134075 (A), filed Jul 02, 1996 , published Oct 17, 2000 - HUTCHINSON TECHNOLOGY
A trace interconnect assembly is designed for transmitting electrical signals to and from a head assembly in a hard disk drive. The interconnect assembly includes one or more single-layer thin, elongated, and generally flat substrate-free trace interconnects....
US6384473 (B1), filed May 16, 2000 , published May 07, 2002 - SANDIA CORP
An apparatus for packaging of microelectronic devices, including an integral window. The microelectronic device can be a semiconductor chip, a CCD chip, a CMOS chip, a VCSEL chip, a laser diode, a MEMS device, or a IMEMS device. The package can include a...
US5471091 (A), filed Aug 26, 1991 , published Nov 28, 1995 - LSI LOGIC CORP
Via filling is enhanced by the techniques of 1) providing pillars immediately underneath semiconductor features, such as metal layer contacts (inter-connection points), and 2) polishing off excess via-filling material so that the via-filling plug is flush with...
US6261856 (B1), filed Dec 10, 1998 , published Jul 17, 2001 - SEMICONDUCTOR ENERGY LAB
A method for treating an object with a laser including emitting a laser beam from a laser; expanding the laser beam in a first direction; removing a portion of the laser beam though a mask, the portion including at least edges of the expanded laser beam...
US6339191 (B1), filed Mar 11, 1994 , published Jan 15, 2002 - SILICON BANDWIDTH INC
A semiconductor die carrier includes a plurality of electrically insulative side walls; a plurality of electrically conductive leads extending from at least one of the side walls, each of the leads being individually manufactured without use of a lead frame; a...
US6414506 (B2), filed Dec 17, 1998 , published Jul 02, 2002 - MICRON TECHNOLOGY INC
A method for testing unpackaged semiconductor dice having raised contact locations (e.g., bumped bond pads) and a method for forming an interconnect suitable for testing this type of dice are provided. The interconnect includes a substrate having contact...
US6707140 (B1), filed May 09, 2000 , published Mar 16, 2004 - NAT SEMICONDUCTOR CORP
A stacked molded package comprising a semiconductor package attached to an electronic device. The semiconductor package includes a semiconductor die which is connected to a set of wire leads and is encapsulated within a protective molding material. Additionall...
US5523697 (A), filed Mar 04, 1994 , published Jun 04, 1996 - MICRON TECHNOLOGY INC
A method of engaging electrically conductive test pads on a semiconductor substrate having integrated circuitry for operability testing thereof includes: a) providing an engagement probe having an outer surface comprising a grouping of a plurality of...
US6660680 (B1), filed Mar 22, 2000 , published Dec 09, 2003 - SUPERIOR MICROPOWDERS LLC
Electrocatalyst powders and methods for producing electrocatalyst powders, such as carbon composite electrocatalyst powders. The powders have a well-controlled microstructure and morphology. The method includes forming the particles from an aerosol of...
US5910685 (A), filed Dec 03, 1997 , published Jun 08, 1999 - AKITA ELECTRONICS CO LTD
In the present invention, memory chips are stuck together in stacked fashion by TAB (tape automated bonding), and a multiple memory chip and lead complex like an SOP (small out-line package) is formed of the chips and leads, whereby a memory module of high...
US4605278 (A), filed May 24, 1985 , published Aug 12, 1986 - NORTH AMERICAN SPECIALITIES
A solder-bearing lead useful as a terminal or contact which may be fabricated by rapid progressive stamping techniques is disclosed in which side ears are formed on the contact blank, and then bent upwardly out of their initial plane. These ears are formed to...
US5931685 (A), filed Jun 02, 1997 , published Aug 03, 1999 - MICRON TECHNOLOGY INC
An interconnect and system for establishing temporary electrical communication with semiconductor components having contact bumps are provided. The interconnect includes a substrate with patterns of contact members adapted to electrically contact the contact...
US4877326 (A), filed Feb 19, 1988 , published Oct 31, 1989 - KLA INSTR CORP
Substrate inspection apparatus and methods, and illumination apparatus. The inspection apparatus and method includes memory for storing the desired features of the surface of the substrate, focussed illuminator for substantially uniformly illuminating a region...
US6766093 (B2), filed Mar 22, 2001 , published Jul 20, 2004 - PANDUIT CORP
A cable manager provides horizontal cable management of adjacent patch panels or network equipment on network distribution racks. The cable manager includes a central section and a front cable routing section and is mountable on a network rack, such as an EIA...
US5239198 (A), filed Jul 02, 1992 , published Aug 24, 1993 - MOTOROLA INC
A low cost manufacturing method is used to fabricate a small multiple chip semiconductor device (10). In one embodiment, a first pattern of conductive traces (14) is formed on one surface of a substrate (12), and a second pattern of traces (16) is formed on a...
US6210537 (B1), filed Jun 19, 1995 , published Apr 03, 2001 - LYNNTECH INC
The present invention provides electronically conducting polymer films formed from photosensitive formulations of pyrrole and an electron acceptor that have been selectively exposed to UV light, laser light, or electron beams. The formulations may include...
US6753922 (B1), filed Oct 13, 1998 , published Jun 22, 2004 - INTEL CORP
An imaging system includes an image sensor that is attached to a circuit board via a mass reflow process. The image sensor captures image data and provides the image data at an output of the imaging system. In one embodiment, the image sensor uses a color...
US5463227 (A), filed Jun 24, 1992 , published Oct 31, 1995 - ROBOTIC VISION SYSTEMS
Methods and arrangements are provided to efficiently use 3-D vision systems to measure selected features of objects that are semi-constrained in compartmented trays having a uniform geometric arrangement. The methods are particularly well suited for optimizing...
US5984464 (A), filed Jul 11, 1997 , published Nov 16, 1999 - HEWLETT PACKARD CO
An inkjet printhead includes a compact substrate of increased stability and structural integrity to provide a high resolution 600 dot-per-inch nozzle array having a one-half inch swath. A plurality of ink vaporization chambers are respectively aligned with the...
US5879965 (A), filed Jun 19, 1997 , published Mar 09, 1999 - MICRON TECHNOLOGY INC
A conductive plastic lead frame and method of manufacturing same, suitable for use in IC packaging. In a preferred embodiment the lead frame is constructed of a plastic or polymer based lead frame structure with an intrinsic conductive polymer coating. In a...
US6838893 (B2), filed Jun 10, 2003 , published Jan 04, 2005 - FORMFACTOR INC
In a probe card assembly, a series of probe elements can be arrayed on a silicon space transformer. The silicon space transformer can be fabricated with an array of primary contacts in a very tight pitch, comparable to the pitch of a semiconductor device. One...
US5518964 (A), filed Jul 07, 1994 , published May 21, 1996 - TESSERA INC
A microelectronic connection component includes a dielectric sheet having an area array of elongated, strip-like leads. Each lead has a terminal end fastened to the sheet and a tip end detachable from the sheet. Each lead extends horizontally parallel to the...
US5137991 (A), filed Oct 19, 1989 , published Aug 11, 1992 - UNIV OHIO STATE RES FOUND
Self-prontonated sulfonic acid-substituted polyaniline compositions, processes for their preparation and uses therefor are disclosed. The sulfonated polyaniline compositions have faster electronic and optical responses to electrochemical potentials comparing...
US4728305 (A), filed Apr 11, 1986 , published Mar 01, 1988 - NORTH AMERICAN SPECIALITIES
A solder-bearing terminal is formed from a blank having a main body portion and side tabs extending laterally from it, which are bent perpendicularly to the main body. The tabs may be formed in pairs to retain a solder mass therebetween, or may be in the form...
US4657136 (A), filed Mar 26, 1985 , published Apr 14, 1987 - RICOH KK
A receptacle for detachably receiving a memory cassette is disclosed. A holder member reciprocates in unison with the movement of an openable cover member to hold the memory cassette thereon. Drive means is provided for driving the holder member in a...
US5673179 (A), filed Jul 29, 1996 , published Sep 30, 1997 - US3 INC
A reinforcement structure to protect an integrated circuit module located within a smart card. The integrated circuit module is positioned in a cavity formed in a first surface of the smart card. The reinforcement structure, which has a modulus of elasticity...
US6342789 (B1), filed Dec 14, 1998 , published Jan 29, 2002 - MICRON TECHNOLOGY INC
A reusable burn-in/test fixture for testing unsingulated dice on a semiconductor wafer consists of two halves. The first half of the test fixture is a wafer cavity plate for receiving the wafer, and the second half establishes electrical communication between...
US5674596 (A), filed Oct 01, 1992 , published Oct 07, 1997 - JOHNSON JOHNSTON ASS INC
A component for use in manufacturing articles such as printed circuit bards comprising a laminate of a sheet of copper foil and a sheet of aluminum or the like. A band of flexible adhesive joins the sheets around their borders and creates a protected central...
US4502193 (A), filed Dec 14, 1981 , published Mar 05, 1985 - HARTWELL CORP
A fastener for locking two objects in a predetermined relationship. The fastener has a fastener body including a spacer which defines a predetermined distance between the two objects. A first locking element is on one side of the spacer and a second locking...
US7125586 (B2), filed Mar 30, 2004 , published Oct 24, 2006 - DELPHI TECH INC
Disclosed is a process for applying a kinetic spray coating of powder particles onto a substrate covered in a plastic-type material without first removing the plastic-type material. In one use of the process a mask is used to enable a single kinetic spray pass...
US5290396 (A), filed Jun 06, 1991 , published Mar 01, 1994 - LSI LOGIC CORP
Various techniques for quantifying polishing performance are disclosed, and provide insight on the progression from a planarization regime to a smoothing regime to a blanket polish back regime, as well as providing a single, definable parameter (Quality...
US6522018 (B1), filed May 16, 2000 , published Feb 18, 2003 - MICRON TECHNOLOGY INC
A stackable ball grid array (BGA) or fine ball grid array (FBGA) semiconductor package particularly suitable for board-on-chip or chip-on-board applications in which a low profile BGA or FBGA semiconductor package is needed. The present invention provides a...
US5326428 (A), filed Sep 03, 1993 , published Jul 05, 1994 - MICRON SEMICONDUCTOR INC
A method of engaging electrically conductive test pads on a semiconductor substrate having integrated circuitry for operability testing thereof includes: a) providing an engagement probe having an outer surface comprising a grouping of a plurality of...
US4778552 (A), filed Apr 22, 1987 , published Oct 18, 1988 - MONARCH MARKING SYSTEMS INC
This invention relates to a deactivatable tag useable with an electronic article surveillance system and comprised of planar conductive material cut into a pair of inverse, first and second spiral conductors wrapped about each other and positioned for...
US6133639 (A), filed Apr 24, 1997 , published Oct 17, 2000 - TESSERA INC
A method and an apparatus for providing a planar and compliant interface between a semiconductor chip and its supporting substrate to accommodate for the thermal coefficient of expansion mismatch therebetween. The complaint interface is comprised of a...
US6537720 (B1), filed Oct 30, 1996 , published Mar 25, 2003 - POLAROID GRAPHICS IMAGING LLC
A unique method/system for simultaneously creating and transferring a contrasting pattern of intelligence on and from an ablation-transfer imaging medium to a receptor element in contiguous registration therewith is not dependent upon contrast imaging...
US4395184 (A), filed Feb 21, 1980 , published Jul 26, 1983 - PALOMAR SYSTEMS MACHINES INC
Miniature electronic component parts such as capacitors or resistors are end conductively coated by use of a part handling plate having a multiplicity of passageways therethrough with walls coated by resilient material to grip the parts. A bank of pins in a...
US6946324 (B1), filed Oct 30, 2003 , published Sep 20, 2005 - ASAT LTD
A process for fabricating a leadless plastic chip carrier includes laminating a first metal strip to a second metal strip to form a leadframe strip, selectively etching the first metal strip to define at least a row of contact pads, mounting a semiconductor...
US4606968 (A), filed Jul 25, 1983 , published Aug 19, 1986 - STERN AND STERN TEXTILES INC
An electrostatic dissipating fabric constructed of a woven or knitted base fabric having an integrally woven or knitted grid structure which is raised above the surface of the base fabric thereby resulting in increased electrostatic dissipation performance....
US6114088 (A), filed Jan 15, 1999 , published Sep 05, 2000 - 3M INNOVATIVE PROPERTIES CO
A thermal transfer element for forming a multilayer device may include a substrate and a multicomponent transfer unit that, when transferred to a receptor, is configured and arranged to form a first operational layer and a second operational layer of a...
US5397857 (A), filed Jul 15, 1993 , published Mar 14, 1995 - DUAL SYSTEMS
A container for a memory card and the process by which the container is manufactured. The container comprises chiefly two stamped steel covers, (an upper and a lower cover half), each secured to a plastic frame element. The cover halves are secured by extended...
US5479331 (A), filed Apr 26, 1994 , published Dec 26, 1995 - COMARCO WIRELESS TECHNOLOGIES
A new, small form factor power supply is disclosed that provides a regulated DC power supply in a package that radiates relatively little heat and that occupies 2.75'' by 4.5'' by 0.75''. The secondary coil of the transformer is positioned at the summing node...
US6569753 (B1), filed Jun 08, 2000 , published May 27, 2003 - MICRON TECHNOLOGY INC
Dielectric collars to be disposed around contact pads on a surface of a semiconductor device or another substrate and methods of fabricating and disposing the collars on semiconductor devices and other substrates. Semiconductor devices including the collars...
US7142000 (B2), filed Sep 29, 2003 , published Nov 28, 2006 - FORMFACTOR INC
Resilient contact structures are mounted directly to bond pads on semiconductor dies, prior to the dies being singulated (separated) from a semiconductor wafer. This enables the semiconductor dies to be exercised (e.g., tested and/or burned-in) by connecting...
US4306925 (A), filed Sep 16, 1980 , published Dec 22, 1981 - PACTEL CORP
A printed circuit which may be highly flexible in configuration and design includes at least one uniformly thick, planar circuit layer including a conductive circuit pattern and an insulating circuit pattern of a cured, flowable insulating material. The...
US4603320 (A), filed Apr 13, 1983 , published Jul 29, 1986 - RAPITECH SYSTEMS INC
A connector interface for enabling communications between first and second data handling systems wherein the data in the first system is arranged in a first type of format and the data in the second system is arranged in a second type of format, includes a...
US6740962 (B1), filed Feb 24, 2000 , published May 25, 2004 - MICRON TECHNOLOGY INC
Stiffeners for tapes, films, or other connective structures that are configured to be secured to a semiconductor device component, such as a semiconductor die or substrate, by tape-automated bonding processes. The stiffeners are fabricated by stereolithographi...
US4666545 (A), filed Jun 27, 1984 , published May 19, 1987 - BERGQUIST CO
A mounting pad means for use in combination with solid-state semiconductive translating devices and including a base pad with flange walls extending from said base pad, and with device mounting pad means being secured to the surface of the base pad and...
US6359236 (B1), filed Aug 13, 1996 , published Mar 19, 2002 - TESSERA INC
A semiconductor chip mounting component includes a support structure having top and bottom surfaces and an edge, a plurality of electrically conductive leads, not attached to a chip, each lead having a first end securement section secured to the support...
US6051878 (A), filed Jan 19, 1999 , published Apr 18, 2000 - MICRON TECHNOLOGY INC
A semiconductor package comprising multiple stacked substrates having flip chips attached to the substrates with chip on board assembly techniques to achieve dense packaging. The substrates are preferably stacked atop one another by electric connections which...
US5821624 (A), filed Jun 05, 1995 , published Oct 13, 1998 - LSI LOGIC CORP
An interposer (preformed planar structure) is disposed between a die and a substrate (which may be another die). Through holes in the interposer facilitate controlled formation of electrical connections between the die and the substrate. In one embodiment, the...
US6356448 (B1), filed Nov 02, 1999 , published Mar 12, 2002 - INCEPTECHNOLOGIES INC
An encapsulated circuit assembly and methods for making an encapsulated circuit assembly for power delivery are disclosed. The assembly comprises a first printed circuit board, a second printed circuit board, and a mechanical coupler. The mechanical coupler is...
US6376049 (B1), filed Jul 23, 1999 , published Apr 23, 2002 - IBIDEN CO LTD
A multilayer printed wiring board is composed of a substrate provided with through-holes, and a wiring board formed on the substrate through the interposition of an interlaminar insulating resin layer, the through-holes having a roughened internal surface and...
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