Top 100 US Patents in Special Component Manufacture (Printed Circuits, etc.)
section h - electricity > electric techniques not otherwise provided for > printed circuits; casings or constructional details of electric apparatus; manufacture of assemblages of electrical components
Sorted by IPQ® Score, an objective measure of patent quality. View scores and methodology at PatentRatings.com. You can also view all by publication date instead.
US5801441 (A), filed
Mon May 15 00:00:00 CDT 1995
, published
Tue Sep 01 00:00:00 CDT 1998
- TESSERA INC
A microelectronic connection component includes a dielectric sheet having an area array of elongated, strip-like leads. Each lead has a terminal end fastened to the sheet and a tip end detachable from the sheet. Each lead extends horizontally parallel to the...
US6124625 (A), filed
Thu Aug 21 00:00:00 CDT 1997
, published
Tue Sep 26 00:00:00 CDT 2000
- MICRON TECHNOLOGY INC
An extensive network of N-channel transistor formed capacitor, with one node tie directly to VCC power bus and the other node directly VSS power bus, is implemented throughout all open space available on the whole silicon chip (memory as well as logic chip),...
US6448628 (B2), filed
Thu Jan 27 00:00:00 CST 2000
, published
Tue Sep 10 00:00:00 CDT 2002
- MICRON TECHNOLOGY INC
An extensive network of N-channel transistor formed capacitor, with one node tie directly to VCC power bus and the other node directly VSS power bus, is implemented throughout all open space available on the whole silicon chip (memory as well as logic chip),...
US4605483 (A), filed
Tue Nov 06 00:00:00 CST 1984
, published
Tue Aug 12 00:00:00 CDT 1986
- MICHAELSON HENRY W
Apparatus for use as an electrode, which is particularly suited for use in electro-plating non-continuous conductive objects, particularly double-sided circuit boards, is described. Specifically, this electrode comprises: a housing having a plurality of sides...
US4599149 (A), filed
Thu Dec 22 00:00:00 CST 1983
, published
Tue Jul 08 00:00:00 CDT 1986
- LEARONAL INC
This invention relates to the electrodeposition of tin, lead and particularly tin-lead alloys from an electroplating bath comprising a lead and/or tin alkylsulfonate, and alkylsulfonic acid in a sufficient amount to impart a pH below about 3 to the bath, and...
US6967183 (B2), filed
Thu Mar 22 00:00:00 CST 2001
, published
Tue Nov 22 00:00:00 CST 2005
- CABOT CORP
Electrocatalyst powders and methods for producing electrocatalyst powders, such as carbon composite electrocatalyst powders. The powders have a well-controlled microstructure and morphology. The method includes forming the particles from an aerosol of...
US5663901 (A), filed
Tue Sep 12 00:00:00 CDT 1995
, published
Tue Sep 02 00:00:00 CDT 1997
- SANDISK CORP
A very small computer memory card is densely packed with a large number of flash EEPROM integrated circuit chips. A computer memory system provides for the ability to removably connect one or more of such cards with a common controller circuit that interfaces...
US5605662 (A), filed
Mon Nov 01 00:00:00 CST 1993
, published
Tue Feb 25 00:00:00 CST 1997
- NANOGEN INC
A self-addressable, self-assembling microelectronic device is designed and fabricated to actively carry out and control multi-step and multiplex molecular biological reactions in microscopic formats. These reactions include nucleic acid hybridization,...
US6983536 (B2), filed
Tue May 18 00:00:00 CDT 2004
, published
Tue Jan 10 00:00:00 CST 2006
- MICRON TECHNOLOGY INC
A method and apparatus for fabricating known good semiconductor dice are provided. The method includes the steps of: testing the gross functionality of dice contained on a semiconductor wafer; sawing the wafer to singulate a die; and then testing the die by...
US5909350 (A), filed
Tue Apr 08 00:00:00 CDT 1997
, published
Tue Jun 01 00:00:00 CDT 1999
- X2Y ATTENUATORS LLC
The present invention relates to a passive electronic component architecture employed in conjunction with various dielectric and combinations of dielectric materials to provide a differential and common mode filter for the suppression of electromagnetic...
US5401176 (A), filed
Thu Mar 17 00:00:00 CST 1994
, published
Tue Mar 28 00:00:00 CST 1995
- BERG TECH INC
A connector device comprises a housing having an internal storage space for inserting one or more storage devices therein. A shallow guide member is coupled along one of the inner side walls of the housing to define upper and lower storage spaces within the...
US6091611 (A), filed
Fri Sep 04 00:00:00 CDT 1998
, published
Tue Jul 18 00:00:00 CDT 2000
- COMARCO WIRELESS TECHNOLOGIES
The subject matter disclosed herein relates to mechanisms for programming power supply circuitry for providing an appropriate current or voltage to powering portable devices or recharge batteries. More particularly, a power supply is coupled to a portable...
US6523079 (B2), filed
Thu Feb 15 00:00:00 CST 2001
, published
Tue Feb 18 00:00:00 CST 2003
- ELONEX TECHNOLOGIES INC
A personal digital assistant module with a local CPU, memory, and I/O interface has a host interface comprising a bus connected to the local CPU and a connector at a surface of the personal digital assistant for interfacing to a bus connector of a host...
US7073254 (B2), filed
Fri Dec 29 00:00:00 CST 2000
, published
Tue Jul 11 00:00:00 CDT 2006
- FORMFACTOR INC
Spring contact elements are fabricated by depositing at least one layer of metallic material into openings defined on a sacrificial substrate. The openings may be within the surface of the substrate, or in one or more layers deposited on the surface of the...
US5393489 (A), filed
Wed Jun 16 00:00:00 CDT 1993
, published
Tue Feb 28 00:00:00 CST 1995
- IBM
Disclosed is a lead-free, high solidus temperature, high Sn alloy. The solder alloys contain in excess of 90 weight percent Sn, and an effective amount of Ag and Bi, optionally with Sb or with Sb and Cu. Another form of the alloy contains Ag and Sb, optionally...
US6294837 (B1), filed
Mon Aug 30 00:00:00 CDT 1999
, published
Tue Sep 25 00:00:00 CDT 2001
- MICRON TECHNOLOGY INC
An interconnect for semiconductor components such as dice, wafers and chip scale packages is provided. The interconnect includes a substrate, and patterns of contacts formed on a face side of the substrate adapted to electrically engage external contacts...
US4849284 (A), filed
Tue Feb 17 00:00:00 CST 1987
, published
Tue Jul 18 00:00:00 CDT 1989
- ROGERS CORP
US6018448 (A), filed
Tue Apr 07 00:00:00 CDT 1998
, published
Tue Jan 25 00:00:00 CST 2000
- X2Y ATTENUATORS LLC
The present invention relates to a passive electronic component architecture employed in conjunction with various dielectric and combinations of dielectric materials to provide one or more differential and common mode filters for the suppression of electromagn...
US7255954 (B2), filed
Thu Oct 24 00:00:00 CDT 2002
, published
Tue Aug 14 00:00:00 CDT 2007
- CABOT CORP
Electrocatalyst powders and energy devices fabricated using electrocatalyst powders and methods for making energy devices. The energy devices, such as fuel cells, have improved performance over a range of operating conditions.
US6741221 (B2), filed
Thu Feb 14 00:00:00 CST 2002
, published
Tue May 25 00:00:00 CDT 2004
- INTEGRAL TECHNOLOGIES INC
Low cost antennas formed of conductive loaded resin-based materials. The conductive loaded resin-based materials are resins filled with conductive materials to provide a material which is a conductor rather than an insulator or body. The conductive materials...
US6908788 (B1), filed
Wed Aug 13 00:00:00 CDT 2003
, published
Tue Jun 21 00:00:00 CDT 2005
- BRIDGE SEMICONDUCTOR CORP
A method of connecting a conductive trace to a semiconductor chip includes providing a semiconductor chip, a conductive trace and a metal base, wherein the chip includes a conductive pad, and the conductive trace is disposed between the metal base and the...
US7115495 (B2), filed
Mon Jun 16 00:00:00 CDT 2003
, published
Tue Oct 03 00:00:00 CDT 2006
- MICRON TECHNOLOGY INC
A bumped semiconductor device contact structure is disclosed including at least one non-planar contact pad having a plurality of projections extending therefrom for contacting at least one solder ball of a bumped integrated circuit (IC) device, such as a...
US5548226 (A), filed
Thu Jun 30 00:00:00 CDT 1994
, published
Tue Aug 20 00:00:00 CDT 1996
- HITACHI LTD
A signal transmitting circuit includes one or more circuit blocks having a driving circuit and an intra-block transmission line for transmitting a signal produced by the driving circuit, one or more circuit blocks having a receiving circuit and an intra-block...
US5656862 (A), filed
Thu May 06 00:00:00 CDT 1993
, published
Tue Aug 12 00:00:00 CDT 1997
- IBM
Solder interconnection encapsulant, encapsulated structure and method for its fabrication and use, whereby the gap created by solder connections between a carrier substrate and a semiconductor device is filled with a composition obtained from curing a...
US6107109 (A), filed
Thu Dec 18 00:00:00 CST 1997
, published
Tue Aug 22 00:00:00 CDT 2000
- MICRON TECHNOLOGY INC
An interconnect for semiconductor components such as dice, wafers and chip scale packages is provided. The interconnect includes a substrate, and patterns of contacts formed on a face side of the substrate adapted to electrically engage external contacts...
US5541525 (A), filed
Mon Nov 14 00:00:00 CST 1994
, published
Tue Jul 30 00:00:00 CDT 1996
- MICRON TECHNOLOGY INC
A carrier for testing an unpackaged semiconductor die is provided. The carrier includes: a base; a temporary interconnect for establishing electrical communication between the die and external test circuitry; a retention mechanism for securing the interconnect...
US4993097 (A), filed
Mon Jan 22 00:00:00 CST 1990
, published
Tue Feb 19 00:00:00 CST 1991
- DEM CONTROLS CANADA
An apparatus and method are disclosed for deburring the surface of a printed circuit board passing along a moving conveyor. The apparatus comprises a rotating brush head for abrading against the first surface of the printed circuit board. A three phase...
US7172785 (B2), filed
Mon Jul 07 00:00:00 CDT 2003
, published
Tue Feb 06 00:00:00 CST 2007
- THOMPSON G ALAN
The invention relates to a process for depositing a metal on a material. The process comprises the steps of: immersing the material in deposition solution comprising the metal; inducing a material vibration in the deposition solution having a frequency...
US5905382 (A), filed
Mon May 06 00:00:00 CDT 1996
, published
Tue May 18 00:00:00 CDT 1999
- MICRON TECHNOLOGY INC
A reusable burn-in/test fixture for testing unsingulated dice on a semiconductor wafer consisting of two halves. The first half of the test fixture is a die cavity plate for receiving the wafer, and the second half establishes electrical communication between...
US6913468 (B2), filed
Fri Oct 10 00:00:00 CDT 2003
, published
Tue Jul 05 00:00:00 CDT 2005
- FORMFACTOR INC
Surface-mount, solder-down sockets are described which permit electronic components such as semiconductor packages to be releasably mounted to a circuit board. Generally, the socket includes resilient contact structures extending from a top surface of a...
US5240169 (A), filed
Thu Oct 15 00:00:00 CDT 1992
, published
Tue Aug 31 00:00:00 CDT 1993
- ELECTROVERT LTD
A cover plate or shroud extends over a solder reservoir and has a slot for a solder wave to extend up above the cover plate. A reduced oxygen atmosphere is supplied from gas outlets under the cover plate on both sides of the solder wave. Furthermore a gas...
US4717438 (A), filed
Mon Sep 29 00:00:00 CDT 1986
, published
Tue Jan 05 00:00:00 CST 1988
- MONARCH MARKING SYSTEMS INC
This invention relates to a tag useable with an electronic article surveillance system and comprised of planar conductive material cut into a pair of inverse, first and second spiral conductors wrapped about each other and positioned for capacitive and...
US6091254 (A), filed
Mon Dec 14 00:00:00 CST 1998
, published
Tue Jul 18 00:00:00 CDT 2000
- MICRON TECHNOLOGY INC
A reusable burn-in/test fixture for testing unsingulated dice on a semiconductor wafer consists of two halves. The first half of the test fixture is a wafer cavity plate for receiving the wafer, and the second half establishes electrical communication between...
US4419675 (A), filed
Thu May 24 00:00:00 CDT 1979
, published
Tue Dec 06 00:00:00 CST 1983
- HOECHST CO AMERICAN
Imaging system and method suitable for producing artwork masters for use in the manufacture of printed circuit boards. A beam of coherent radiation is modulated in accordance with data from a source defining the image to be produced, and the modulated beam is...
US6104087 (A), filed
Mon Aug 24 00:00:00 CDT 1998
, published
Tue Aug 15 00:00:00 CDT 2000
- TESSERA INC
A microelectronic connection component includes a dielectric sheet having an area array of elongated, strip-like leads. Each lead has a terminal end fastened to the sheet and a tip end detachable from the sheet. Each lead extends horizontally parallel to the...
US4959751 (A), filed
Tue Jan 17 00:00:00 CST 1989
, published
Tue Sep 25 00:00:00 CDT 1990
- DELCO ELECTRONICS CORP
A printed circuit board assembly uses a conductive pattern that includes both firmly adherent conductors and controllably adherent conductors. The controllably adhering conductors are free to lift off the printed circuit board to relieve mechanical forces...
US5491597 (A), filed
Fri Apr 15 00:00:00 CDT 1994
, published
Tue Feb 13 00:00:00 CST 1996
- HUTCHINSON TECHNOLOGY
A gimbal flexure and electrical interconnect assembly for attachment to a disk drive suspension assembly. The gimbal flexure and electrical interconnect acts both as an interconnect system for relaying electrical signals and as a gimbal flexure. It comprises a...
US4327124 (A), filed
Thu Dec 13 00:00:00 CST 1979
, published
Tue Apr 27 00:00:00 CDT 1982
- DESMARAIS JR RAYMOND C
Printed circuits are produced by an additive technique wherein a metal-loaded resinous ink is first printed on the board, the circuit next being covered with a conductive metal powder while the ink is still wet. The powder is then pressed into the ink and the...
US5068712 (A), filed
Tue Sep 19 00:00:00 CDT 1989
, published
Tue Nov 26 00:00:00 CST 1991
- HITACHI LTD
As the semiconductor chip is large-sized, highly integrated and speeded up, it becomes difficult to pack the semiconductor chip together with leads in a package. In view of this difficulty, there has been adopted the package structure called the "Lead-On-Chip"...
US5218034 (A), filed
Wed Aug 21 00:00:00 CDT 1991
, published
Tue Jun 08 00:00:00 CDT 1993
- DU PONT
USRE36396 (E), filed
Fri Jan 27 00:00:00 CST 1995
, published
Tue Nov 16 00:00:00 CST 1999
- ROGERS CORP
A ceramic filled fluoropolymer-based electrical substrate material well suited for forming rigid printed wiring board substrate materials and integrated circuit chip carriers is presented which exhibits improved electrical performance over other printed wiring...
US6304450 (B1), filed
Thu Jul 15 00:00:00 CDT 1999
, published
Tue Oct 16 00:00:00 CDT 2001
- INCEP TECHNOLOGIES INC
An encapsulated circuit assembly and a method for making an encapsulated circuit assembly are disclosed. The assembly comprises a first printed circuit board, a second printed circuit board, and a heat transfer device. The second printed circuit board...
US7077882 (B2), filed
Fri Jul 16 00:00:00 CDT 2004
, published
Tue Jul 18 00:00:00 CDT 2006
- CABOT CORP
Gold powders and methods for producing gold powders. The powders preferably have a small particle size, narrow size distribution and a spherical morphology. The method includes forming the particles by a spray pyrolysis technique. The invention also includes...
US5914481 (A), filed
Tue Oct 07 00:00:00 CDT 1997
, published
Tue Jun 22 00:00:00 CDT 1999
- NORAND CORP
A pocket-sized hand-held data processing device with a coupling system, a user interface and an optical indicia reader. The device can include a display to display alphanumeric information. The display can have a touch screen input area and a handwritten input...
US4754009 (A), filed
Thu Sep 04 00:00:00 CDT 1986
, published
Tue Jun 28 00:00:00 CDT 1988
- DU PONT
Amorphous copolymer of perfluoro-2,2-dimethyl-1,3-dioxide with at least one fluoro comonomer selected from one or more of ten defined classes having a recited minimum mole proportion of perfluoro-2,2-dimethyl-1,3-dioxole, in no event less than 65%, have high...
US6184568 (B1), filed
Fri Nov 07 00:00:00 CST 1997
, published
Tue Feb 06 00:00:00 CST 2001
- MICRON TECHNOLOGY INC
A SIMM (single in-line memory module) board is provided with a plurality of integrated semiconductor memory or other integrated semiconductor circuit devices which include, as a part of each integrated circuit device, a current spike leveling capacitor. The...
US5530286 (A), filed
Mon Aug 22 00:00:00 CDT 1994
, published
Tue Jun 25 00:00:00 CDT 1996
- HITACHI LTD
As the semiconductor chip is large-sized, highly integrated and speeded up, it becomes difficult to pack the semiconductor chip together with leads in a package. In view of this difficulty, there has been adopted the package structure called the "Lead-On-Chip"...
US6134075 (A), filed
Tue Jul 02 00:00:00 CDT 1996
, published
Tue Oct 17 00:00:00 CDT 2000
- HUTCHINSON TECHNOLOGY
A trace interconnect assembly is designed for transmitting electrical signals to and from a head assembly in a hard disk drive. The interconnect assembly includes one or more single-layer thin, elongated, and generally flat substrate-free trace interconnects....
US6384473 (B1), filed
Tue May 16 00:00:00 CDT 2000
, published
Tue May 07 00:00:00 CDT 2002
- SANDIA CORP
An apparatus for packaging of microelectronic devices, including an integral window. The microelectronic device can be a semiconductor chip, a CCD chip, a CMOS chip, a VCSEL chip, a laser diode, a MEMS device, or a IMEMS device. The package can include a...
US5471091 (A), filed
Mon Aug 26 00:00:00 CDT 1991
, published
Tue Nov 28 00:00:00 CST 1995
- LSI LOGIC CORP
Via filling is enhanced by the techniques of 1) providing pillars immediately underneath semiconductor features, such as metal layer contacts (inter-connection points), and 2) polishing off excess via-filling material so that the via-filling plug is flush with...
US6261856 (B1), filed
Thu Dec 10 00:00:00 CST 1998
, published
Tue Jul 17 00:00:00 CDT 2001
- SEMICONDUCTOR ENERGY LAB
A method for treating an object with a laser including emitting a laser beam from a laser; expanding the laser beam in a first direction; removing a portion of the laser beam though a mask, the portion including at least edges of the expanded laser beam...
US6339191 (B1), filed
Fri Mar 11 00:00:00 CST 1994
, published
Tue Jan 15 00:00:00 CST 2002
- SILICON BANDWIDTH INC
A semiconductor die carrier includes a plurality of electrically insulative side walls; a plurality of electrically conductive leads extending from at least one of the side walls, each of the leads being individually manufactured without use of a lead frame; a...
US6414506 (B2), filed
Thu Dec 17 00:00:00 CST 1998
, published
Tue Jul 02 00:00:00 CDT 2002
- MICRON TECHNOLOGY INC
A method for testing unpackaged semiconductor dice having raised contact locations (e.g., bumped bond pads) and a method for forming an interconnect suitable for testing this type of dice are provided. The interconnect includes a substrate having contact...
US6707140 (B1), filed
Tue May 09 00:00:00 CDT 2000
, published
Tue Mar 16 00:00:00 CST 2004
- NAT SEMICONDUCTOR CORP
A stacked molded package comprising a semiconductor package attached to an electronic device. The semiconductor package includes a semiconductor die which is connected to a set of wire leads and is encapsulated within a protective molding material. Additionall...
US5523697 (A), filed
Fri Mar 04 00:00:00 CST 1994
, published
Tue Jun 04 00:00:00 CDT 1996
- MICRON TECHNOLOGY INC
A method of engaging electrically conductive test pads on a semiconductor substrate having integrated circuitry for operability testing thereof includes: a) providing an engagement probe having an outer surface comprising a grouping of a plurality of...
US6660680 (B1), filed
Wed Mar 22 00:00:00 CST 2000
, published
Tue Dec 09 00:00:00 CST 2003
- SUPERIOR MICROPOWDERS LLC
Electrocatalyst powders and methods for producing electrocatalyst powders, such as carbon composite electrocatalyst powders. The powders have a well-controlled microstructure and morphology. The method includes forming the particles from an aerosol of...
US5910685 (A), filed
Wed Dec 03 00:00:00 CST 1997
, published
Tue Jun 08 00:00:00 CDT 1999
- AKITA ELECTRONICS CO LTD
In the present invention, memory chips are stuck together in stacked fashion by TAB (tape automated bonding), and a multiple memory chip and lead complex like an SOP (small out-line package) is formed of the chips and leads, whereby a memory module of high...
US4605278 (A), filed
Fri May 24 00:00:00 CDT 1985
, published
Tue Aug 12 00:00:00 CDT 1986
- NORTH AMERICAN SPECIALITIES
A solder-bearing lead useful as a terminal or contact which may be fabricated by rapid progressive stamping techniques is disclosed in which side ears are formed on the contact blank, and then bent upwardly out of their initial plane. These ears are formed to...
US5931685 (A), filed
Mon Jun 02 00:00:00 CDT 1997
, published
Tue Aug 03 00:00:00 CDT 1999
- MICRON TECHNOLOGY INC
An interconnect and system for establishing temporary electrical communication with semiconductor components having contact bumps are provided. The interconnect includes a substrate with patterns of contact members adapted to electrically contact the contact...
US4877326 (A), filed
Fri Feb 19 00:00:00 CST 1988
, published
Tue Oct 31 00:00:00 CST 1989
- KLA INSTR CORP
Substrate inspection apparatus and methods, and illumination apparatus. The inspection apparatus and method includes memory for storing the desired features of the surface of the substrate, focussed illuminator for substantially uniformly illuminating a region...
US6766093 (B2), filed
Thu Mar 22 00:00:00 CST 2001
, published
Tue Jul 20 00:00:00 CDT 2004
- PANDUIT CORP
A cable manager provides horizontal cable management of adjacent patch panels or network equipment on network distribution racks. The cable manager includes a central section and a front cable routing section and is mountable on a network rack, such as an EIA...
US5239198 (A), filed
Thu Jul 02 00:00:00 CDT 1992
, published
Tue Aug 24 00:00:00 CDT 1993
- MOTOROLA INC
A low cost manufacturing method is used to fabricate a small multiple chip semiconductor device (10). In one embodiment, a first pattern of conductive traces (14) is formed on one surface of a substrate (12), and a second pattern of traces (16) is formed on a...
US6210537 (B1), filed
Mon Jun 19 00:00:00 CDT 1995
, published
Tue Apr 03 00:00:00 CDT 2001
- LYNNTECH INC
The present invention provides electronically conducting polymer films formed from photosensitive formulations of pyrrole and an electron acceptor that have been selectively exposed to UV light, laser light, or electron beams. The formulations may include...
US6753922 (B1), filed
Tue Oct 13 00:00:00 CDT 1998
, published
Tue Jun 22 00:00:00 CDT 2004
- INTEL CORP
An imaging system includes an image sensor that is attached to a circuit board via a mass reflow process. The image sensor captures image data and provides the image data at an output of the imaging system. In one embodiment, the image sensor uses a color...
US5463227 (A), filed
Wed Jun 24 00:00:00 CDT 1992
, published
Tue Oct 31 00:00:00 CST 1995
- ROBOTIC VISION SYSTEMS
Methods and arrangements are provided to efficiently use 3-D vision systems to measure selected features of objects that are semi-constrained in compartmented trays having a uniform geometric arrangement. The methods are particularly well suited for optimizing...
US5984464 (A), filed
Fri Jul 11 00:00:00 CDT 1997
, published
Tue Nov 16 00:00:00 CST 1999
- HEWLETT PACKARD CO
An inkjet printhead includes a compact substrate of increased stability and structural integrity to provide a high resolution 600 dot-per-inch nozzle array having a one-half inch swath. A plurality of ink vaporization chambers are respectively aligned with the...
US5879965 (A), filed
Thu Jun 19 00:00:00 CDT 1997
, published
Tue Mar 09 00:00:00 CST 1999
- MICRON TECHNOLOGY INC
A conductive plastic lead frame and method of manufacturing same, suitable for use in IC packaging. In a preferred embodiment the lead frame is constructed of a plastic or polymer based lead frame structure with an intrinsic conductive polymer coating. In a...
US6838893 (B2), filed
Tue Jun 10 00:00:00 CDT 2003
, published
Tue Jan 04 00:00:00 CST 2005
- FORMFACTOR INC
In a probe card assembly, a series of probe elements can be arrayed on a silicon space transformer. The silicon space transformer can be fabricated with an array of primary contacts in a very tight pitch, comparable to the pitch of a semiconductor device. One...
US5518964 (A), filed
Thu Jul 07 00:00:00 CDT 1994
, published
Tue May 21 00:00:00 CDT 1996
- TESSERA INC
A microelectronic connection component includes a dielectric sheet having an area array of elongated, strip-like leads. Each lead has a terminal end fastened to the sheet and a tip end detachable from the sheet. Each lead extends horizontally parallel to the...
US5137991 (A), filed
Thu Oct 19 00:00:00 CDT 1989
, published
Tue Aug 11 00:00:00 CDT 1992
- UNIV OHIO STATE RES FOUND
Self-prontonated sulfonic acid-substituted polyaniline compositions, processes for their preparation and uses therefor are disclosed. The sulfonated polyaniline compositions have faster electronic and optical responses to electrochemical potentials comparing...
US4728305 (A), filed
Fri Apr 11 00:00:00 CST 1986
, published
Tue Mar 01 00:00:00 CST 1988
- NORTH AMERICAN SPECIALITIES
A solder-bearing terminal is formed from a blank having a main body portion and side tabs extending laterally from it, which are bent perpendicularly to the main body. The tabs may be formed in pairs to retain a solder mass therebetween, or may be in the form...
US4657136 (A), filed
Tue Mar 26 00:00:00 CST 1985
, published
Tue Apr 14 00:00:00 CDT 1987
- RICOH KK
A receptacle for detachably receiving a memory cassette is disclosed. A holder member reciprocates in unison with the movement of an openable cover member to hold the memory cassette thereon. Drive means is provided for driving the holder member in a...
US5673179 (A), filed
Mon Jul 29 00:00:00 CDT 1996
, published
Tue Sep 30 00:00:00 CDT 1997
- US3 INC
A reinforcement structure to protect an integrated circuit module located within a smart card. The integrated circuit module is positioned in a cavity formed in a first surface of the smart card. The reinforcement structure, which has a modulus of elasticity...
US6342789 (B1), filed
Mon Dec 14 00:00:00 CST 1998
, published
Tue Jan 29 00:00:00 CST 2002
- MICRON TECHNOLOGY INC
A reusable burn-in/test fixture for testing unsingulated dice on a semiconductor wafer consists of two halves. The first half of the test fixture is a wafer cavity plate for receiving the wafer, and the second half establishes electrical communication between...
US5674596 (A), filed
Thu Oct 01 00:00:00 CDT 1992
, published
Tue Oct 07 00:00:00 CDT 1997
- JOHNSON JOHNSTON ASS INC
A component for use in manufacturing articles such as printed circuit bards comprising a laminate of a sheet of copper foil and a sheet of aluminum or the like. A band of flexible adhesive joins the sheets around their borders and creates a protected central...
US4502193 (A), filed
Mon Dec 14 00:00:00 CST 1981
, published
Tue Mar 05 00:00:00 CST 1985
- HARTWELL CORP
A fastener for locking two objects in a predetermined relationship. The fastener has a fastener body including a spacer which defines a predetermined distance between the two objects. A first locking element is on one side of the spacer and a second locking...
US7125586 (B2), filed
Tue Mar 30 00:00:00 CST 2004
, published
Tue Oct 24 00:00:00 CDT 2006
- DELPHI TECH INC
Disclosed is a process for applying a kinetic spray coating of powder particles onto a substrate covered in a plastic-type material without first removing the plastic-type material. In one use of the process a mask is used to enable a single kinetic spray pass...
US5290396 (A), filed
Thu Jun 06 00:00:00 CDT 1991
, published
Tue Mar 01 00:00:00 CST 1994
- LSI LOGIC CORP
Various techniques for quantifying polishing performance are disclosed, and provide insight on the progression from a planarization regime to a smoothing regime to a blanket polish back regime, as well as providing a single, definable parameter (Quality...
US6522018 (B1), filed
Tue May 16 00:00:00 CDT 2000
, published
Tue Feb 18 00:00:00 CST 2003
- MICRON TECHNOLOGY INC
A stackable ball grid array (BGA) or fine ball grid array (FBGA) semiconductor package particularly suitable for board-on-chip or chip-on-board applications in which a low profile BGA or FBGA semiconductor package is needed. The present invention provides a...
US5326428 (A), filed
Fri Sep 03 00:00:00 CDT 1993
, published
Tue Jul 05 00:00:00 CDT 1994
- MICRON SEMICONDUCTOR INC
A method of engaging electrically conductive test pads on a semiconductor substrate having integrated circuitry for operability testing thereof includes: a) providing an engagement probe having an outer surface comprising a grouping of a plurality of...
US4778552 (A), filed
Wed Apr 22 00:00:00 CDT 1987
, published
Tue Oct 18 00:00:00 CDT 1988
- MONARCH MARKING SYSTEMS INC
This invention relates to a deactivatable tag useable with an electronic article surveillance system and comprised of planar conductive material cut into a pair of inverse, first and second spiral conductors wrapped about each other and positioned for...
US6133639 (A), filed
Thu Apr 24 00:00:00 CDT 1997
, published
Tue Oct 17 00:00:00 CDT 2000
- TESSERA INC
A method and an apparatus for providing a planar and compliant interface between a semiconductor chip and its supporting substrate to accommodate for the thermal coefficient of expansion mismatch therebetween. The complaint interface is comprised of a...
US6537720 (B1), filed
Wed Oct 30 00:00:00 CST 1996
, published
Tue Mar 25 00:00:00 CST 2003
- POLAROID GRAPHICS IMAGING LLC
A unique method/system for simultaneously creating and transferring a contrasting pattern of intelligence on and from an ablation-transfer imaging medium to a receptor element in contiguous registration therewith is not dependent upon contrast imaging...
US4395184 (A), filed
Thu Feb 21 00:00:00 CST 1980
, published
Tue Jul 26 00:00:00 CDT 1983
- PALOMAR SYSTEMS MACHINES INC
Miniature electronic component parts such as capacitors or resistors are end conductively coated by use of a part handling plate having a multiplicity of passageways therethrough with walls coated by resilient material to grip the parts. A bank of pins in a...
US6946324 (B1), filed
Thu Oct 30 00:00:00 CST 2003
, published
Tue Sep 20 00:00:00 CDT 2005
- ASAT LTD
A process for fabricating a leadless plastic chip carrier includes laminating a first metal strip to a second metal strip to form a leadframe strip, selectively etching the first metal strip to define at least a row of contact pads, mounting a semiconductor...
US4606968 (A), filed
Mon Jul 25 00:00:00 CDT 1983
, published
Tue Aug 19 00:00:00 CDT 1986
- STERN AND STERN TEXTILES INC
An electrostatic dissipating fabric constructed of a woven or knitted base fabric having an integrally woven or knitted grid structure which is raised above the surface of the base fabric thereby resulting in increased electrostatic dissipation performance....
US6114088 (A), filed
Fri Jan 15 00:00:00 CST 1999
, published
Tue Sep 05 00:00:00 CDT 2000
- 3M INNOVATIVE PROPERTIES CO
A thermal transfer element for forming a multilayer device may include a substrate and a multicomponent transfer unit that, when transferred to a receptor, is configured and arranged to form a first operational layer and a second operational layer of a...
US5397857 (A), filed
Thu Jul 15 00:00:00 CDT 1993
, published
Tue Mar 14 00:00:00 CST 1995
- DUAL SYSTEMS
A container for a memory card and the process by which the container is manufactured. The container comprises chiefly two stamped steel covers, (an upper and a lower cover half), each secured to a plastic frame element. The cover halves are secured by extended...
US5479331 (A), filed
Tue Apr 26 00:00:00 CDT 1994
, published
Tue Dec 26 00:00:00 CST 1995
- COMARCO WIRELESS TECHNOLOGIES
A new, small form factor power supply is disclosed that provides a regulated DC power supply in a package that radiates relatively little heat and that occupies 2.75'' by 4.5'' by 0.75''. The secondary coil of the transformer is positioned at the summing node...
US6569753 (B1), filed
Thu Jun 08 00:00:00 CDT 2000
, published
Tue May 27 00:00:00 CDT 2003
- MICRON TECHNOLOGY INC
Dielectric collars to be disposed around contact pads on a surface of a semiconductor device or another substrate and methods of fabricating and disposing the collars on semiconductor devices and other substrates. Semiconductor devices including the collars...
US7142000 (B2), filed
Mon Sep 29 00:00:00 CDT 2003
, published
Tue Nov 28 00:00:00 CST 2006
- FORMFACTOR INC
Resilient contact structures are mounted directly to bond pads on semiconductor dies, prior to the dies being singulated (separated) from a semiconductor wafer. This enables the semiconductor dies to be exercised (e.g., tested and/or burned-in) by connecting...
US4306925 (A), filed
Tue Sep 16 00:00:00 CDT 1980
, published
Tue Dec 22 00:00:00 CST 1981
- PACTEL CORP
A printed circuit which may be highly flexible in configuration and design includes at least one uniformly thick, planar circuit layer including a conductive circuit pattern and an insulating circuit pattern of a cured, flowable insulating material. The...
US4603320 (A), filed
Wed Apr 13 00:00:00 CST 1983
, published
Tue Jul 29 00:00:00 CDT 1986
- RAPITECH SYSTEMS INC
A connector interface for enabling communications between first and second data handling systems wherein the data in the first system is arranged in a first type of format and the data in the second system is arranged in a second type of format, includes a...
US6740962 (B1), filed
Thu Feb 24 00:00:00 CST 2000
, published
Tue May 25 00:00:00 CDT 2004
- MICRON TECHNOLOGY INC
Stiffeners for tapes, films, or other connective structures that are configured to be secured to a semiconductor device component, such as a semiconductor die or substrate, by tape-automated bonding processes. The stiffeners are fabricated by stereolithographi...
US4666545 (A), filed
Wed Jun 27 00:00:00 CDT 1984
, published
Tue May 19 00:00:00 CDT 1987
- BERGQUIST CO
A mounting pad means for use in combination with solid-state semiconductive translating devices and including a base pad with flange walls extending from said base pad, and with device mounting pad means being secured to the surface of the base pad and...
US6359236 (B1), filed
Tue Aug 13 00:00:00 CDT 1996
, published
Tue Mar 19 00:00:00 CST 2002
- TESSERA INC
A semiconductor chip mounting component includes a support structure having top and bottom surfaces and an edge, a plurality of electrically conductive leads, not attached to a chip, each lead having a first end securement section secured to the support...
US6051878 (A), filed
Tue Jan 19 00:00:00 CST 1999
, published
Tue Apr 18 00:00:00 CDT 2000
- MICRON TECHNOLOGY INC
A semiconductor package comprising multiple stacked substrates having flip chips attached to the substrates with chip on board assembly techniques to achieve dense packaging. The substrates are preferably stacked atop one another by electric connections which...
US5821624 (A), filed
Mon Jun 05 00:00:00 CDT 1995
, published
Tue Oct 13 00:00:00 CDT 1998
- LSI LOGIC CORP
An interposer (preformed planar structure) is disposed between a die and a substrate (which may be another die). Through holes in the interposer facilitate controlled formation of electrical connections between the die and the substrate. In one embodiment, the...
US6356448 (B1), filed
Tue Nov 02 00:00:00 CST 1999
, published
Tue Mar 12 00:00:00 CST 2002
- INCEPTECHNOLOGIES INC
An encapsulated circuit assembly and methods for making an encapsulated circuit assembly for power delivery are disclosed. The assembly comprises a first printed circuit board, a second printed circuit board, and a mechanical coupler. The mechanical coupler is...
US6376049 (B1), filed
Fri Jul 23 00:00:00 CDT 1999
, published
Tue Apr 23 00:00:00 CDT 2002
- IBIDEN CO LTD
A multilayer printed wiring board is composed of a substrate provided with through-holes, and a wiring board formed on the substrate through the interposition of an interlaminar insulating resin layer, the through-holes having a roughened internal surface and...
