Top 100 US Patents in Measuring and Testing
section g - physics >
measuring; testing >
measuring electric variables; measuring magnetic variables
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US6671537 (B1), filed
May 31, 1995
, published
Dec 30, 2003
- BONUTTI 2003 TRUST A
A method to simulate within an imaging coil normal movements of body parts such as joints, and improve imaging of soft tissue and bony parts as compared to a static system in which images are taken of a joint in only one position. A joint or body parts is...
US4988947 (A), filed
Sep 13, 1989
, published
Jan 29, 1991
- UNIV MINNESOTA
Two amplitude/frequency/phase modulated pulses that can achieve 90 DEG plane rotations over large B1 field inhomogeneities are described. The pulses achieve this by use of a "flip" in the direction of the effective B1 field half-way through the pulse, and by...
US4926452 (A), filed
Oct 30, 1987
, published
May 15, 1990
- FOUR PI SYSTEMS CORP
A tomographic inspection system wherein the electron beam of a microfocus X-ray tube is deflected in a circular scan pattern onto the tube anode in synchronization with a rotating detector that converts the X-ray shadowgraph into an optical image and derotates...
US5220281 (A), filed
Jan 28, 1992
, published
Jun 15, 1993
- TOKYO SHIBAURA ELECTRIC CO
A boundary scan cell is disclosed. Bi-directional input/output terminals are connected to bi-directional input/output terminals of a logic circuit subject to test in order to store test data or a test result in a first latch circuit, the output impedance of...
US6801461 (B2), filed
Dec 17, 2001
, published
Oct 05, 2004
- TEXAS INSTRUMENTS INC
An integrated circuit has a built-in self-test (BIST) arrangement (60). The built-in self-test arrangement includes a read only memory (ROM), (140) that stores test algorithm instructions. A ROM logic circuit (410) receives an instruction read from the read...
US5159271 (A), filed
Jul 24, 1990
, published
Oct 27, 1992
- COMMISSARIAT ENERGIE ATOMIQUE
Turbine for the analysis of samples by nuclear magnetic resonance. It comprises a rotor (7) having a spherical central core (8), whereof a cavity (9) contains the solid sample to be analyzed. Two conical surfaces are provided on either side of the central core...
US6310484 (B1), filed
Jun 28, 1999
, published
Oct 30, 2001
- MICRON TECHNOLOGY INC
An interconnect for testing semiconductor components includes a substrate, and interconnect contacts on the substrate for electrically engaging terminal contacts on the components. The interconnect also includes one or more cavities in the substrate which form...
US6498503 (B2), filed
Dec 04, 2000
, published
Dec 24, 2002
- MICRON TECHNOLOGY INC
An interconnect for testing semiconductor components includes a substrate, and interconnect contacts on the substrate for electrically engaging terminal contacts on the components. The interconnect also includes one or more cavities in the substrate which form...
US4297637 (A), filed
Jul 20, 1978
, published
Oct 27, 1981
- UNIV CALIFORNIA
Densities of resonant nuclei within elemental volumes along a line are measured using the nuclear magnetic resonance phenomenon called "spin echo." A first planar volume of nuclei is selectively excited to nutate spins by approximately 90 DEG . Thereafter a...
US6600359 (B1), filed
Nov 03, 1999
, published
Jul 29, 2003
- MICRON TECHNOLOGY INC
An integrated device includes a redundant bond pad for accessing internal circuitry in the event that the main bond pad for that circuitry is difficult to access with testing equipment. Signals from the redundant bond pad are biased to ground during normal...
US4873459 (A), filed
May 18, 1988
, published
Oct 10, 1989
- ACTEL CORP
A user-programmable interconnect architecture, which may be used for logic arrays for digital and analog system design, is disclosed. In one embodiment, a plurality of logic cells or modules in a matrix are connected by vertical and horizontal wiring channels....
US4873459 (B1), filed
May 18, 1988
, published
Jan 10, 1995
- ACTEL CORP
US4761768 (A), filed
Mar 04, 1985
, published
Aug 02, 1988
- LATTICE SEMICONDUCTOR CORP
An improved programmable logic device (PLD) is disclosed which employs electrically erasable memory cells which can be programmed and erased at high speed. The PLD memory cells comprise floating gate transistors as the storage elements, which are programmed...
US4908568 (A), filed
Apr 28, 1988
, published
Mar 13, 1990
- SIEMENS AG
A mechanical probe for optical measurement of electrical potentials. The probe of the present invention is composed of a cubic, electro-optical crystal fashioned in the form of a tip and of a metallization which is at ground potential and which covers the...
US5406566 (A), filed
Oct 22, 1993
, published
Apr 11, 1995
- NIPPON ELECTRIC CO
A dynamic random access memory device is subjected to a diagnosis upon completion of fabrication to see whether or not a defective memory cell is incorporated in memory cell sub-arrays, one of the input/output data buffer circuits incorporated therein...
US6889072 (B2), filed
Jul 05, 2001
, published
May 03, 2005
The present invention is a method and apparatus for providing preferential enhancement of an artery of interest relative to adjacent veins and background tissue. The method and apparatus adapts the timing of a maximum or substantially elevated rate of infusion...
US6983536 (B2), filed
May 18, 2004
, published
Jan 10, 2006
- MICRON TECHNOLOGY INC
A method and apparatus for fabricating known good semiconductor dice are provided. The method includes the steps of: testing the gross functionality of dice contained on a semiconductor wafer; sawing the wafer to singulate a die; and then testing the die by...
US5825195 (A), filed
Oct 30, 1995
, published
Oct 20, 1998
- MICRON TECHNOLOGY INC
Optical alignment techniques, such as those used in "flip chip" bonding, are used to establish ohmic contact with the die by means of raised portions on contact members. This permits accurate alignment with a temporary die fixture in order to test the die. The...
US5390191 (A), filed
Jan 21, 1993
, published
Feb 14, 1995
- SONY CORP
An integrated circuit for boundary scan is achieved to be simple structure. A testing apparatus 6 provides a testing data to a serial input port SI of a integrated circuit IC1 via a external terminal unit 2. The testing data is output to a parallel input port...
US6864201 (B2), filed
Jun 13, 2001
, published
Mar 08, 2005
- SYMYX TECHNOLOGIES INC
Methods and apparatus for the preparation and use of a substrate having an array of diverse materials in predefined regions thereon. A substrate having an array of diverse materials thereon is generally prepared by delivering components of materials to...
US5083083 (A), filed
Jul 05, 1989
, published
Jan 21, 1992
- ACTEL CORP
In a user-configurable integrated circuit including a plurality of uncommitted conductors which may be programmably connected to one another and to functional circuit blocks by a user to form electronic circuits, apparatus for testing for defects in the form...
US6407546 (B1), filed
Apr 07, 2000
, published
Jun 18, 2002
A method and system for identifying thicknesses of inspection samples, such as semiconductor wafers is presented. The method and system includes a probe housing, comprising an eddy current sense coil and a linear motion controller, and a computer that controls...
US7019519 (B2), filed
Aug 24, 2004
, published
Mar 28, 2006
- LE CUONG DUY
A method for monitoring an inspection sample includes generating inspection data comprising resistance and reactance measurements that are obtained from an inspection sample having a conductive layer of unknown thickness. Calibration data is used for...
US5268852 (A), filed
Oct 25, 1991
, published
Dec 07, 1993
- ROSEMOUNT ANALYTICAL INC
An apparatus and method for measuring potentiometric electrode impedance for diagnostic purpose while continuously reading the results of the process value. A square wave is applied to an external circuit, which in turn is coupled to an electrode assembly...
US4864512 (A), filed
Aug 20, 1986
, published
Sep 05, 1989
- FLUKE MFG CO JOHN
A measuring device includes a microprocessor controller programmed for performing any of a plurality of mathematical functions on a measured value of a parameter under test. The measuring device is provided with two displays, for displaying to a user both the...
US6353563 (B1), filed
Mar 15, 1999
, published
Mar 05, 2002
- TEXAS INSTRUMENTS INC
An integrated circuit has a built-in self-test (BIST) arrangement (60). The built-in self-test arrangement includes a read only memory (ROM), (140) that stores test algorithm instructions. A ROM logic circuit (410) receives an instruction read from the read...
US4709202 (A), filed
Jun 19, 1986
, published
Nov 24, 1987
- NORAND CORP
In an exemplary embodiment, a battery conditioning system monitors battery conditioning and includes a memory for storing data based thereon; for example, data may be stored representative of available battery capacity as measured during a deep discharge...
US7098055 (B2), filed
Oct 06, 2005
, published
Aug 29, 2006
- HITACHI HIGH TECH CORP
A defect inspection method includes radiating an illumination slit-shaped beam having lights substantially parallel to a longitudinal direction to a substrate having circuit patterns in a direction inclined at a predetermined gradient relative to the direction...
US5883843 (A), filed
Apr 30, 1997
, published
Mar 16, 1999
- TEXAS INSTRUMENTS INC
An integrated circuit has a built-in self-test (BIST) arrangement (60). The built-in self-test arrangement includes a read only memory (ROM), (140) that stores test algorithm instructions. A ROM logic circuit (410) receives an instruction read from the read...
US5015885 (A), filed
Feb 10, 1989
, published
May 14, 1991
- ACTEL CORP
A user-programmable interconnect architecture, which may be used for logic arrays for digital and analog system design, is disclosed. In one embodiment, a plurality of logic cells or modules in a matrix are connected by vertical and horizontal wiring channels....
US6310590 (B1), filed
Aug 11, 1999
, published
Oct 30, 2001
- TEXAS DIGITAL SYSTEMS INC
A method for continuously controlling color of a display device comprises the steps of receiving three sets of data respectively representing the portions of three primary colors, accumulating three counts in accordance with the data, respectively, and setting...
US6182247 (B1), filed
Oct 27, 1997
, published
Jan 30, 2001
- ALTERA CORP
A technique for embedding a logic analyzer in a programmable logic device allows debugging of such a device in its actual operating conditions. A logic analyzer circuit is embedded within a PLD, it captures and stores logic signals, and it unloads these...
US5734863 (A), filed
Aug 17, 1994
, published
Mar 31, 1998
- NAT INSTR CORP
A type definition ability in a graphical programming environment which enables a user to assign a name to a custom control that the user intends to use throughout one or more virtual instruments. The user can create a master or original of a control and use...
US6704895 (B1), filed
Nov 01, 1999
, published
Mar 09, 2004
- TEXAS INSTRUMENTS INC
An emulation device including a serial scan testability interface having at least first and second scan paths, and state machine circuitry connected and responsive to said second scan path generally operable for emulation control.
US6697659 (B1), filed
Jul 17, 1998
, published
Feb 24, 2004
- BONUTTI 2003 TRUST A
An apparatus and method for use in medical imaging simulate within an imaging coil normal movements of body parts such as joints, and improve imaging of soft tissue and bony parts as compared to a static system in which images are taken of a joint in only one...
US7161175 (B2), filed
Jan 21, 2005
, published
Jan 09, 2007
- SHAU JENG-JYE
The present invention discloses novel methods to transfer data between a plurality of integrated circuit dice on a semiconductor wafer. Each individual die contains internal circuits to control data transfer to nearby dice. Wafer level data transfer is...
US6670819 (B2), filed
Jan 24, 2002
, published
Dec 30, 2003
- MICRON TECHNOLOGY INC
A method of engaging electrically conductive test pads on a semiconductor substrate having integrated circuitry for operability testing thereof includes: a) providing an engagement probe having an outer surface comprising a grouping of a plurality of...
US4732043 (A), filed
Aug 11, 1986
, published
Mar 22, 1988
- BELL MICROSENSORS INC
A method and apparatus are disclosed for deriving digital signals from analog variations of different sensing elements in a transducer. Each sensing device controls the frequency of a variable frequency oscillator, which is energized when a reading is to be...
US5222030 (A), filed
Apr 06, 1990
, published
Jun 22, 1993
- LSI LOGIC CORP
US4854710 (A), filed
Jul 23, 1987
, published
Aug 08, 1989
- THERMA WAVE INC
A method and apparatus are disclosed for evaluating surface and subsurface features in a semiconductor sample. In operation, a periodic energy source is applied to the surface of the semiconductor sample to generate a periodic electron-hole plasma. This plasma...
USRE36325 (E), filed
Sep 26, 1995
, published
Oct 05, 1999
- MICRON TECHNOLOGY INC
A leadframe interconnect package is tape automated bond (TAB) bonded to circuitry on the chip and which provides a circuit connection for subsequent connection to a printed circuit board. The encapsulated chips will replace both the leadframe and printed...
US5541525 (A), filed
Nov 14, 1994
, published
Jul 30, 1996
- MICRON TECHNOLOGY INC
A carrier for testing an unpackaged semiconductor die is provided. The carrier includes: a base; a temporary interconnect for establishing electrical communication between the die and external test circuitry; a retention mechanism for securing the interconnect...
US6496940 (B1), filed
Jun 07, 1995
, published
Dec 17, 2002
- COMPAQ COMPUTER CORP
A multiprocessor system includes a number of sub-processor systems, each substantially identically constructed, and each comprising a central processing unit (CPU), and at least one I/O device, interconnected by routing apparatus that also interconnects the...
US5097492 (A), filed
Feb 12, 1990
, published
Mar 17, 1992
- FOUR PI SYSTEMS CORP
A tomographic inspection system wherein the electron beam of a microfocus X-ray tube is deflected in a circular scan pattern onto the tube anode in synchronization with a rotating detector that converts the X-ray shadowgraph into an optical image and derotates...
US5985356 (A), filed
Oct 18, 1994
, published
Nov 16, 1999
- SYMYX TECHNOLOGIES INC
Methods and apparatus for the preparation and use of a substrate having an array of diverse materials in predefined regions thereon. A substrate having an array of diverse materials thereon is generally prepared by delivering components of materials to...
USRE37740 (E1), filed
Jan 17, 1995
, published
Jun 11, 2002
- KLA TENCOR CORP
Substrate inspection apparatus and methods, and illumination apparatus. The inspection apparatus and method includes memory for storing the desired features of the surface of the substrate, focussed illuminator for substantially uniformly illuminating a region...
US4746991 (A), filed
Jan 12, 1982
, published
May 24, 1988
- DISCOVISION ASS
US4240149 (A), filed
Feb 16, 1979
, published
Dec 16, 1980
- LEEDS NORTHRUP
There is provided a method for measuring a parameter whose value is calculable as an integral with time of a function of at least one variable so as to make possible the use of a microprocessor when measurements of such variables are desired. The variable is...
US5905382 (A), filed
May 06, 1996
, published
May 18, 1999
- MICRON TECHNOLOGY INC
A reusable burn-in/test fixture for testing unsingulated dice on a semiconductor wafer consisting of two halves. The first half of the test fixture is a die cavity plate for receiving the wafer, and the second half establishes electrical communication between...
US4827945 (A), filed
Jun 26, 1987
, published
May 09, 1989
- ADVANCED MAGNETICS INC
This invention relates to materials exhibiting certain magnetic and biological properties which make them uniquely suitable for use as magnetic resonance imaging (MRI) agents to enhance MR images of animal organs and tissues. More particularly, the invention...
US6913468 (B2), filed
Oct 10, 2003
, published
Jul 05, 2005
- FORMFACTOR INC
Surface-mount, solder-down sockets are described which permit electronic components such as semiconductor packages to be releasably mounted to a circuit board. Generally, the socket includes resilient contact structures extending from a top surface of a...
US5712566 (A), filed
Feb 23, 1996
, published
Jan 27, 1998
- WESTERN ATLAS INT INC
A nuclear magnetic resonance apparatus including a magnet generating a static magnetic field in a first region containing materials to be analyzed. The magnet generates zero static magnetic field in a second region. The magnet has generally homogeneous...
US6690343 (B2), filed
Mar 20, 2001
, published
Feb 10, 2004
- TEXAS DIGITAL SYSTEMS INC
A method for automatically evaluating the displayed value comprises the steps of receiving data for display, exhibiting a display indication of the data on a light emitting diode display area substantially surrounded by a variable color background area,...
US5737622 (A), filed
Sep 22, 1993
, published
Apr 07, 1998
- NAT INSTR CORP
An occurrence capability which allows a first function to "go to sleep" while waiting for a second function to produce a result. In this manner, the first function does not consume any CPU time while waiting for the second function. Three icons are provided...
US6181126 (B1), filed
Jun 17, 1999
, published
Jan 30, 2001
- TEXAS DIGITAL SYSTEMS INC
A measuring system performs measurement of two measured values and simultaneously exhibits the two measurement results in a digital format on a single variable color display device in respectively different colors, in order to distinguish them comfortably.
US7047059 (B2), filed
Mar 27, 2001
, published
May 16, 2006
- QUANTUM MAGNETICS INC
A probe instrument using room-temperature sensor(s) that can measure variations in magnetic susceptibilities. The instrument has sufficient resolution to monitor paramagnetic materials in a human body, such as iron in a human liver, by noninvasively examining...
US6424327 (B2), filed
Aug 11, 1999
, published
Jul 23, 2002
- TEXAS DIGITAL SYSTEMS INC
A multicolor display element includes a plurality of display areas arranged in a pattern, each including light emitting diodes of respective primary colors, which are coupled to the buses in accordance with their colors. A single enable input is provided for...
US6882877 (B2), filed
Sep 18, 2003
, published
Apr 19, 2005
- BONUTTI RES INC
The present invention relates to a magnetic resonance imaging system that includes a stationary electromagnet, a patient support for maintaining a patient in a standing or seated position, and an actuator for raising and lowering the patient relative to a...
US4721913 (A), filed
Aug 15, 1986
, published
Jan 26, 1988
- MCW RES FOUND INC
Counter Rotating Current (CRC) pairs of loop-gap resonators are combined with planar pairs of loop-gap resonators to form networks of NMR local coils. A first embodiment is a quadrature probe in which a planar pair is sandwiched between the loop-gap resonators...
US6091254 (A), filed
Dec 14, 1998
, published
Jul 18, 2000
- MICRON TECHNOLOGY INC
A reusable burn-in/test fixture for testing unsingulated dice on a semiconductor wafer consists of two halves. The first half of the test fixture is a wafer cavity plate for receiving the wafer, and the second half establishes electrical communication between...
US6751562 (B1), filed
Mar 22, 2001
, published
Jun 15, 2004
- POWER MEASUREMENT LTD
A power management architecture for an electrical power distribution system, or portion thereof, is disclosed. The architecture includes multiple intelligent electronic devices ("IED's") distributed throughout the power distribution system to manage the flow...
US7084656 (B1), filed
Oct 21, 1996
, published
Aug 01, 2006
- FORMFACTOR INC
An interconnection contact structure assembly including an electronic component having a surface and a conductive contact carried by the electronic component and accessible at the surface. The contact structure includes an internal flexible elongate member...
US6728113 (B1), filed
Jun 24, 1993
, published
Apr 27, 2004
- POLYCHIP INC
Apparatus is described for capacitively signalling between different semiconductor chips and modules without the use of connectors, solder bumps, wire-bond interconnections or the like. Preferably, pairs of half-capacitor plates, one half located on each chip,...
US5578526 (A), filed
May 01, 1995
, published
Nov 26, 1996
- MICRON TECHNOLOGY INC
A method for forming a multi chip module for singulated semiconductor dice or dice contained on a wafer is provided. The method includes forming an interconnect adapted to support and establish an electrical connection with the dice. The interconnect includes...
US6545498 (B2), filed
Mar 28, 2001
, published
Apr 08, 2003
- MICRON TECHNOLOGY INC
Flip-chip semiconductor assemblies, each including integrated circuit (IC) dice and an associated substrate, are electrically tested before encapsulation using an in-line or in-situ test socket or probes at a die-attach station. Those assemblies using "wet"...
US6551845 (B1), filed
Jan 02, 1996
, published
Apr 22, 2003
- MICRON TECHNOLOGY INC
A method of using adhesive tape to temporarily retain a die being temporarily held in a fixture during testing and burn-in. The method of the present invention uses a die cut piece of adhesively coated tape to hold a die in a test and burn-in fixture. Upon...
US6657450 (B2), filed
Oct 01, 1999
, published
Dec 02, 2003
- MICRON TECHNOLOGY INC
A method of engaging electrically conductive test pads on a semiconductor substrate having integrated circuitry for operability testing thereof includes: a) providing an engagement probe having an outer surface comprising a grouping of a plurality of...
US4589815 (A), filed
Aug 11, 1983
, published
May 20, 1986
- INTEST CORP
A system for positioning an electronic test head of a test system with respect to an electronic device handler. A positioner assembly moves vertically and provides substantial movement in the horizontal plane with six degrees of freedom. The positioner...
US4589815 (B1), filed
Aug 11, 1983
, published
Apr 07, 1998
- INTEST CORP
US6546505 (B1), filed
Jul 01, 1999
, published
Apr 08, 2003
- TEXAS INSTRUMENTS INC
A data processing device including a semiconductor chip, an electronic processor on-chip and an on-chip condition sensor connected to the electronic processor for analysis of the operations.
US4901221 (A), filed
Apr 14, 1986
, published
Feb 13, 1990
- NAT INSTR CORP
A method for programming a computer system having a display console for displaying images to control at least one of a virtual instrument and an instrument by the steps of displaying on the screen at least one first function-icon that references at least one...
US5220512 (A), filed
Jul 20, 1992
, published
Jun 15, 1993
- LSI LOGIC CORP
A system for interactive, design and stimulation of an electronic circuit allowing a user to design a circuit by graphical entry and to view full or partial simulation and design results, simultaneously, on a single display window. The user is able to define...
US5964835 (A), filed
Jun 07, 1995
, published
Oct 12, 1999
- TANDEM COMPUTERS INC
A multiprocessor system includes a number of central processing unit (CPUs) and at least one input/output (I/O) device interconnected by routing apparatus for communicating packetized messages therebetween. The messages contain address information identifying...
US6686758 (B1), filed
Mar 23, 2000
, published
Feb 03, 2004
- MICRON TECHNOLOGY INC
A method of engaging electrically conductive test pads on a semiconductor substrate having integrated circuitry for operability testing thereof includes: a) providing an engagement probe having an outer surface comprising a grouping of a plurality of...
US4933638 (A), filed
Jun 19, 1989
, published
Jun 12, 1990
- SCHLUMBER TECHNOLOGY CORP
Borehole NMR logging apparatus and methods, and methods for the interpretation thereof. A logging tool is provided which produces a strong, static and homogeneous magnetic field B0 in a Volume of an adjacent formation on one side of the tool to measure nuclear...
US6492822 (B2), filed
Oct 30, 2001
, published
Dec 10, 2002
- CASCADE MICROTECH INC
A probe station includes a fully guarded chuck assembly and connector mechanism for increasing sensitivity to low-level currents while reducing settling times. The chuck assembly includes a wafer-supporting first chuck element surrounded by a second chuck...
US7078926 (B2), filed
Aug 23, 2004
, published
Jul 18, 2006
- FORMFACTOR INC
Techniques for performing wafer-level burn-in and test of semiconductor devices include a test substrate having active electronic components such as ASICs mounted to an interconnection substrate or incorporated therein, metallic spring contact elements...
US5914953 (A), filed
Jun 07, 1995
, published
Jun 22, 1999
- TANDEM COMPUTERS INC
A processing system includes multiple processor units and multiple input/output elements communicatively interconnected by a system area network having a plurality of multi-ported router elements. Communication between the system elements uses message packets...
US6414506 (B2), filed
Dec 17, 1998
, published
Jul 02, 2002
- MICRON TECHNOLOGY INC
A method for testing unpackaged semiconductor dice having raised contact locations (e.g., bumped bond pads) and a method for forming an interconnect suitable for testing this type of dice are provided. The interconnect includes a substrate having contact...
US6759870 (B2), filed
Feb 20, 2003
, published
Jul 06, 2004
- ALTERA CORP
A programmable logic array integrated circuit has a number of programmable logic modules which are grouped together in a plurality of logic array blocks ("LABs"). The LABs are arranged on the circuit in a two dimensional array. A conductor network is provided...
US5523697 (A), filed
Mar 04, 1994
, published
Jun 04, 1996
- MICRON TECHNOLOGY INC
A method of engaging electrically conductive test pads on a semiconductor substrate having integrated circuitry for operability testing thereof includes: a) providing an engagement probe having an outer surface comprising a grouping of a plurality of...
US4992850 (A), filed
Feb 15, 1989
, published
Feb 12, 1991
- MICRON TECHNOLOGY INC
A leadframe interconnect package is tape automated bond (TAB) bonded to circuitry on the chip and which provides a circuit connection for subsequent connection to a printed circuit board. The encapsulated chips will replace both the leadframe and printed...
US7368678 (B2), filed
Aug 13, 2002
, published
May 06, 2008
- MICRON TECHNOLOGY INC
A method for sorting integrated circuit (IC) devices of the type having a substantially unique identification (ID) code, such as a fuse ID, including automatically reading the ID code of each of the IC devices and sorting the IC devices in accordance with...
US6380754 (B1), filed
Mar 12, 1999
, published
Apr 30, 2002
- MICRON TECHNOLOGY INC
A method of engaging electrically conductive test pads on a semiconductor substrate having integrated circuitry for operability testing thereof includes: a) providing an engagement probe having an outer surface comprising a grouping of a plurality of...
US5233191 (A), filed
Apr 02, 1991
, published
Aug 03, 1993
- HITACHI LTD
Method and apparatus of detecting, analyzing and evaluating the content of foreign matters such as dusts and impurities contained in various materials, units, processes and environment standing for constituting components of a mass production line during mass...
US5931685 (A), filed
Jun 02, 1997
, published
Aug 03, 1999
- MICRON TECHNOLOGY INC
An interconnect and system for establishing temporary electrical communication with semiconductor components having contact bumps are provided. The interconnect includes a substrate with patterns of contact members adapted to electrically contact the contact...
US4209852 (A), filed
Nov 11, 1974
, published
Jun 24, 1980
- HYATT GILBERT P
An improved arrangement is provided for processing analog and digital signals, where particular advantages are obtained using charge coupled devices (CCDs). A memory arrangement utilizes a novel refresh circuit to re-establish signal amplitudes which are...
US4877326 (A), filed
Feb 19, 1988
, published
Oct 31, 1989
- KLA INSTR CORP
Substrate inspection apparatus and methods, and illumination apparatus. The inspection apparatus and method includes memory for storing the desired features of the surface of the substrate, focussed illuminator for substantially uniformly illuminating a region...
US6559668 (B1), filed
Jan 24, 2000
, published
May 06, 2003
- CASCADE MICROTECH INC
A low-current pogo probe card for measuring currents down to the femtoamp region includes a laminate board having a layer of conductive traces interposed between two dielectric layers. A plurality of probing devices, such as ceramic blades, are edge-mounted...
US5196833 (A), filed
Aug 13, 1991
, published
Mar 23, 1993
- FORD MOTOR CO
A low voltage detection circuit includes bandgap and differential comparator circuits for generating a first signal proportional to the level of the supply voltage when it exceeds a predetermined range, and an output driver responsive to the first signal for...
US6734837 (B1), filed
Jun 16, 1999
, published
May 11, 2004
- TEXAS DIGITAL SYSTEMS INC
A variable color optical device repeatedly develops a start signal and two end signals respectively timed in relation to the start signal in accordance with the values of two sets of data. Two stable signals are developed, each from the start signal to the...
US6087845 (A), filed
Nov 04, 1998
, published
Jul 11, 2000
- MICRON TECHNOLOGY INC
A reusable burn-in/test fixture for testing unsingulated dice on a semiconductor wafer consists of two halves. The first half of the test fixture is a wafer cavity plate for receiving the wafer, and the second half establishes electrical communication between...
US6477200 (B1), filed
Nov 09, 1999
, published
Nov 05, 2002
- BROADCOM CORP
Various systems and methods providing high speed decoding, enhanced power reduction and clock domain partitioning for a multi-pair gigabit Ethernet transceiver are disclosed. ISI compensation is partitioned into two stages; a first stage compensates ISI...
US4441075 (A), filed
Jul 02, 1981
, published
Apr 03, 1984
- IBM
Design rules and test structure are used to implement machine designs to thereby obviate during testing the need for mechanical probing of the chip, multichip module, card or board at a higher level of package. The design rules and test structure also provide...
US6549006 (B2), filed
Apr 17, 2001
, published
Apr 15, 2003
A method for identifying metal layer thickness of an inspection sample according to one embodiment utilizes an eddy current probe to obtain initial resistance and reactance measurements from the inspection sample. Once these measurements have been obtained,...
US4258317 (A), filed
Apr 12, 1979
, published
Mar 24, 1981
- LEWIS ENGINEERING COMPANY
An electrical indicator device for providing simultaneous relatively coarse analog, and higher-resolution, digital readings of a particular electrical parameter, all in one instrument. The device includes a d'Arsonval meter movement which carries a pointer...
US4800378 (A), filed
Aug 23, 1985
, published
Jan 24, 1989
- SNAP ON TOOLS CORP
US5675807 (A), filed
Jun 07, 1995
, published
Oct 07, 1997
- TANDEM COMPUTERS INC
A multiprocessor system includes a number of sub-processor systems, each substantially identically constructed, and each comprising a central processing unit (CPU), and at least one I/O device, interconnected by routing apparatus that also interconnects the...
USRE40188 (E1), filed
Dec 12, 2002
, published
Mar 25, 2008
- ICID LLC
An integrated circuit identification device (ICID) to be incorporated into an integrated circuit (IC) includes an array of electronic cells in which the magnitude of an output signal of each cell is a function of randomly occurring parametric variations which...
US6201394 (B1), filed
Nov 21, 1997
, published
Mar 13, 2001
- FONAR CORP
A magnet for magnetic resonance imaging has an interior working space within the magnet frame sufficient to accommodate a physician and a patient. Because the physician is positioned inside the magnet frame, the physician has unimpeded access to the patient....