Semiconductor chip assemblies, methods of making same and components for same - Patent US7198969(B1)

Filed: Sep 07, 2000

Published: Apr 03, 2007

Abstract

Semiconductor chip assemblies incorporating flexible, sheet-like elements having terminals thereon overlying the front or rear face of the chip to provide a compact unit. The terminals on the sheet-like element are movable with respect to the chip, so as to compensate for thermal expansion. A resilient element such as a compliant layer interposed between the chip and terminals permits independent movement of the individual terminals toward the chip driving engagement with a test probe assembly so as to permit reliable engagement despite tolerances.

Applicants

TESSERA INC

Inventors

KHANDROS IGOR Y
DISTEFANO THOMAS H

Application Number

09656690

Priority Claims

US58675890

Family Members

US2002155728(A1) - Semiconductor chip assemblies, methods of making same and components for same

US7198969(B1) - Semiconductor chip assemblies, methods of making same and components for same

US7291910(B2) - Semiconductor chip assemblies, methods of making same and components for same

Classification Codes

H01L21/00, H01L21/822, H01L21/50, H01L23/13, H01L23/28, H01L23/485, H01L23/58, H01L23/48, H01L21/48, H01L21/60, H01L21/98, H01L21/322, H01L23/12, H01L23/31, H01L21/02, H01L21/70, H01L25/16, H01L21/44, H01L23/498